Intel has given a close-up of its next-gen Meteor Lake client and Granite Rapids data center CPUs which utilize advanced packaging technologies.
Intel Shows Off Its Advanced Packaging Prowess With Next-Gen Granite Rapids Data Center & Meteor Lake Client CPU Chip Shots
In a PR published by Intel, Chipzilla highlights the various chipmaking technologies that are being utilized at its Arizona and Oregon fabs for the production of next-gen chips. Intel, while being late to the chiplet era, has picked up the pace recently with its Sapphire Rapids and Ponte Vecchio not only being advanced chiplet designs but taking it to the next level through the use of Foveros and EMIB technologies. The company's disaggregated chiplet roadmap also takes shape later this fall with the launch of Meteor Lake, its first full-on chiplet design, and the first "Core Ultra" lineup for clients.
Following Meteor Lake, Intel will once again be firing up all barrels in the data center segment with not one but two distinct Xeon families, the P-Core-based Granite Rapids & the E-Core-based Sierra Forest.
Today's close-up gives us a look at the 2nd Gen chiplet-based Data Center product, Granite Rapids-SP, which will be compatible with the LGA 4710 socket (Birch Stream platform). This massive chip is composed of five chiplets with the three in the middle being an XCC Compute tile while the two on the outer sides responsible for I/O and additional controllers. Intel also shows off the organic sub-strate layer & which can be seen utilizing at least 8 EMIB interconnects for each separate chiplet.
We also get a close-up on Intel's Meteor Lake CPUs and while we have seen the die shot on several occasions, this time we get to see an interesting package that is coupled with on-die memory. This particular SKU utilizes two LPDDR5x DRAM dies from Samsung (K3KL3L30CM) on the same package & will result in some very interesting mobility solutions, especially in terms of size & compactness. There will also be the standard off-package DRAM solutions within the Meteor Lake lineup.
Intel’s advanced packaging technologies extend and drive Moore’s Law as the company aspires to a trillion transistors in a package by 2030. Intel has led the industry in advanced packaging for a couple decades. Its innovations include EMIB (embedded multi-die interconnect bridge) and Foveros, technologies that allow multiple chips on a package to be connected side by side (EMIB) or stacked on top of one another in a 3D fashion (Foveros).
As Moore's Law has been progressing, traditional scaling has been slowing down,” says Ann Kelleher, executive vice president and general manager of Intel’s Technology Development. “But as we start doing advanced packaging and heterogeneous integration, it means we can pack a lot more components into a given package and a given product.
Intel’s packaging technology is also a competitive advantage for Intel Foundry Services (IFS).
via Intel
Intel's Meteor Lake CPU lineup is expected to be unveiled at the upcoming Innovation event this month while Granite Rapids CPUs are expected to ship around mid-2024.
WccftechContinue reading/original-link]
