WccftechContinue reading/original-link]

Amazon is offering the SiriusXM Roady BT In-Vehicle Satellite Radio Kit for $69.99 shipped. Down 30% from its normal going rate at Amazon, today’s deal marks a new low that we’ve tracked there and is also the first discount all-time at the retailer. Designed to deliver in-vehicle entertainment, the Roady BT satellite radio installs in your car and connects to your stereo through Bluetooth, 3.5mm aux, or over a built-in FM transmitter. You can choose to mount it via a magnetic vent or dash adapter and there’s an additional mounting system that’s sold separately should you need it. Plus, it comes with a three month free trial of Sirius XM or you could opt for 12 months of the brand’s Platinum Programming Package for $99. Keep reading for more.

more…

The post SiriusXM Roady BT in-car satellite radio kit lets you tune in anywhere for $70 (First sale) appeared first on 9to5Toys.

WccftechContinue reading/original-link]

8 C
New York
[tds_menu_login guest_tdicon="td-icon-profile" logout_tdicon="td-icon-log-out" tdc_css="eyJhbGwiOnsibWFyZ2luLWJvdHRvbSI6IjAiLCJkaXNwbGF5IjoiIn19" toggle_txt_color="var(--news-hub-white)" menu_offset_top="eyJhbGwiOiIxOSIsImxhbmRzY2FwZSI6IjE3IiwicG9ydHJhaXQiOiIxNSJ9" menu_offset_horiz="eyJhbGwiOi02LCJsYW5kc2NhcGUiOiItMyIsInBvcnRyYWl0IjoiLTIifQ==" menu_horiz_align="content-horiz-right" menu_bg="var(--news-hub-black)" menu_uh_color="var(--news-hub-light-grey)" menu_uh_border_color="var(--news-hub-dark-grey)" menu_ul_link_color="#ffffff" menu_ul_link_color_h="var(--news-hub-accent-hover)" menu_ul_sep_color="var(--news-hub-dark-grey)" menu_uf_txt_color="var(--news-hub-white)" menu_uf_txt_color_h="var(--news-hub-accent-hover)" menu_uf_border_color="var(--news-hub-dark-grey)" f_uh_font_family="325" f_uh_font_line_height="1.3" f_links_font_family="325" f_links_font_line_height="1.3" f_uf_font_line_height="1.3" f_uf_font_family="325" menu_uh_padd="eyJhbGwiOiIyMHB4IDI1cHggMThweCIsImxhbmRzY2FwZSI6IjE1cHggMjBweCAxM3B4IiwicG9ydHJhaXQiOiIxMHB4IDE1cHggOHB4In0=" menu_ul_padd="eyJhbGwiOiIxOHB4IDI1cHgiLCJsYW5kc2NhcGUiOiIxNnB4IDIwcHgiLCJwb3J0cmFpdCI6IjhweCAxNXB4In0=" menu_ul_space="eyJhbGwiOiIxMCIsImxhbmRzY2FwZSI6IjgiLCJwb3J0cmFpdCI6IjYifQ==" menu_ulo_padd="eyJhbGwiOiIxOHB4IDI1cHggMjBweCIsImxhbmRzY2FwZSI6IjEzcHggMjBweCAxNXB4IiwicG9ydHJhaXQiOiI4cHggMTVweCAxMHB4In0=" menu_shadow_shadow_size="0" menu_arrow_color="rgba(255,255,255,0)" menu_width="eyJhbGwiOiIyMjAiLCJwb3J0cmFpdCI6IjE4MCJ9" show_version="" menu_gh_padd="eyJhbGwiOiIyMHB4IDI1cHggMThweCIsImxhbmRzY2FwZSI6IjE1cHggMjBweCAxM3B4IiwicG9ydHJhaXQiOiIxMHB4IDE1cHggOHB4In0=" menu_gc_padd="eyJhbGwiOiIxOHB4IDI1cHggMjBweCIsImxhbmRzY2FwZSI6IjEzcHggMjBweCAxNXB4IiwicG9ydHJhaXQiOiI4cHggMTVweCAxMHB4In0=" menu_gh_color="var(--news-hub-light-grey)" menu_gh_border_color="var(--news-hub-dark-grey)" f_gh_font_family="325" menu_gc_btn1_bg_color="var(--news-hub-accent)" menu_gc_btn1_bg_color_h="var(--news-hub-accent-hover)" menu_gc_btn2_color="var(--news-hub-accent)" menu_gc_btn2_color_h="var(--news-hub-accent-hover)" f_btn1_font_family="325" f_btn1_font_transform="uppercase" f_btn2_font_family="325" f_btn2_font_transform="uppercase" f_btn1_font_weight="700" f_btn2_font_weight="700" show_menu="yes" f_uf_font_size="eyJsYW5kc2NhcGUiOiIxMiIsInBvcnRyYWl0IjoiMTIifQ==" icon_color="var(--news-hub-white)" icon_size="eyJhbGwiOjIyLCJsYW5kc2NhcGUiOiIyMCIsInBvcnRyYWl0IjoiMTgifQ==" avatar_size="eyJhbGwiOiIyMiIsImxhbmRzY2FwZSI6IjIwIiwicG9ydHJhaXQiOiIxOCJ9" ia_space="eyJhbGwiOiIxMCIsImxhbmRzY2FwZSI6IjgiLCJwb3J0cmFpdCI6IjYifQ==" f_toggle_font_family="325" f_toggle_font_size="eyJhbGwiOiIxNCIsImxhbmRzY2FwZSI6IjEzIiwicG9ydHJhaXQiOiIxMiJ9" logout_size="eyJhbGwiOjE0LCJsYW5kc2NhcGUiOiIxMyJ9" f_uh_font_size="eyJsYW5kc2NhcGUiOiIxMyIsInBvcnRyYWl0IjoiMTIifQ==" f_links_font_size="eyJsYW5kc2NhcGUiOiIxMyIsInBvcnRyYWl0IjoiMTIifQ==" f_gh_font_size="eyJsYW5kc2NhcGUiOiIxMyIsInBvcnRyYWl0IjoiMTIifQ=="]

Samsung’s Answer To TSMC’s CoWoS Is “SAINT” – Samsung Advanced Interconnection Technology For Next-Gen Chips

Published:

Samsung is readying its own chip packaging solution to rival TSMC's CoWoS which is reportedly going to be called SAINT. Samsung SAINT & TSMC CoWoS Technologies Are Going To Compete To Secure Orders For Advanced Chip Packaging From Major Chipmakers Including NVIDIA & AMD The latest report comes from The Korean Economic Daily which is reporting that the Korean tech giant, Samsung, is readying its own advanced packaging solution to compete against the widely popular CoWoS (Chip-on-Wafer-on-Substrate) packaging technology from TSMC. It is reported that Samsung plans to unveil its solution next year and will be calling it SAINT or […]

Read full article at https://wccftech.com/samsungs-answer-tsmc-cowos-saint-advanced-interconnection-technology-next-gen-chips/

WccftechContinue reading/original-link]

Related articles

spot_img

Recent articles

spot_img