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Samsung’s Answer To TSMC’s CoWoS Is “SAINT” – Samsung Advanced Interconnection Technology For Next-Gen Chips

NewsTech

Published:

Samsung is readying its own chip packaging solution to rival TSMC's CoWoS which is reportedly going to be called SAINT. Samsung SAINT & TSMC CoWoS Technologies Are Going To Compete To Secure Orders For Advanced Chip Packaging From Major Chipmakers Including NVIDIA & AMD The latest report comes from The Korean Economic Daily which is reporting that the Korean tech giant, Samsung, is readying its own advanced packaging solution to compete against the widely popular CoWoS (Chip-on-Wafer-on-Substrate) packaging technology from TSMC. It is reported that Samsung plans to unveil its solution next year and will be calling it SAINT or […]

Read full article at https://wccftech.com/samsungs-answer-tsmc-cowos-saint-advanced-interconnection-technology-next-gen-chips/

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