The Korean memory manufacturer SK Hynix has decided to break from the industry's tradition of semiconductor development, as they plan to integrate memory and logic semiconductors on the same die. SK Hynix Believes That Interconnectivity Through Packaging Methods Is "Inefficient," Plans On Taking A Different Route According to reports by Korean outlets, SK Hynix believes there is a possibility of a more "efficient" implementation of semiconductor placements in the market, which the firm believes they can achieve with next-gen HBM4 memory. It is said that SK Hynix has hired a considerable number of design experts for logic semiconductors, which in […]
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