Samsung has reportedly ordered a significant amount of 2.5D packaging equipment, hinting that the Korean giant might see huge demand from industry giants such as NVIDIA. Samsung Starts Prepping 2.5D Packaging Supply, Potentially For NVIDIA's Next-Gen "Blackwell" AI GPUs Samsung has recently stepped into the AI bandwagon with the announcement of its SAINT tech which will rival TSMC's CoWoS packaging solution. With this, Samsung is expected to offer its packaging and HBM capabilities to the industry and has been able to grasp the attention of none other than NVIDIA. We all are well aware that currently, Team Green is unable […]
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