TSMC is reportedly giving its all regarding the highly demanding CoWoS supply, as the Taiwanese giant plans to double down on production this year. TSMC Doubling CoWoS Production As AI Bandwagon Is Expected To Ride Its Way Into 2024, Expanding The Supply & Demand Chain To New Levels CoWoS packaging is considered a vital part of creating the necessary hardware for AI computing, especially for AI accelerators, such as NVIDIA's H100s. With the advent of the generative AI hype, GPU manufacturers rushed towards "pushing out" AI-focused products at their maximum capacity, which ultimately prompted the demand for CoWoS packaging as […]
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