NVIDIA has reportedly turned its hopes toward Intel to fulfill its "immense" advanced packaging demand, as TSMC & others face a huge supply bottleneck. NVIDIA Finally Includes Intel On Its AI Bandwagon, Diversifies CoWoS Supply Through TSMC, Intel & Others Onboard CoWoS packaging is considered a vital part of creating the necessary hardware for AI computing, especially for AI accelerators, such as NVIDIA's H100s. With the advent of the generative AI hype, GPU manufacturers rushed towards "pushing out" AI-focused products at their maximum capacity, which ultimately has prompted the demand for CoWoS packaging as well. Since NVIDIA is leading the […]
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