Development on the next-gen HBM4 memory standard is in full swing as TSMC, Samsung & SK hynix prep the latest DRAM & process nodes. TSMC Brings Forward 12nm & 5nm Nodes For HBM4 Memory Base Dies, Samsung & SK hynix Go 1c DRAM Route Both Samsung and SK hynix are in the race to offer the next-generation HBM4 memory standard. The Korean giants have shown their initial plans for a 2025-2026 debut. Samsung has so far eyed the use of 3D Packaging technologies and up to 16-Hi stacks for an unprecedented increase in the VRAM capacities and memory bandwidth while […]
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