The Taiwan Semiconductor Manufacturing Company's (TSMC) bid to rapidly increase its chip packaging capacity in the wake of strong demand by the artificial intelligence industry has faced a setback after potential archaeological ruins were discovered at a site for a new plant. TSMC is planning to build two Chip on Wafer on Substrate (CoWoS) packaging plants in Chiayi, Taiwan, and reports on social media quoted in the Taiwanese press share that the National Taiwan University is recruiting trained personnel for archaeological excavations. TSMC plans to build two CoWoS packaging plants in Chiyai, and statements made by the Taiwanese government made […]
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