Chip manufacturer Intel Corpration's contract manufacturing plans have apparently been dealt with a setback as wafer tests run by Broadcom's analysts have failed to yield satisfactory results, according to sources quoted by Reuters. These tests covered Intel's leading edge semiconductor technology, 18A, and after Intel shipped its customer the wafers last month, Broadloom's tests concluded that the process technology was not ready to move to high volume production. Semiconductor production takes place in phases, with high volume production being one of the final stages after chip manufacturers have fine tuned their equipment before feeling comfortable to risk thousands of wafers […]
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