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TSMC & US-Based Amkor Technologies To Bring In CoWoS Production Into The US, Pivotal Moment For The AI Markets

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TSMC & US-Based Amkor Technologies To Bring In CoWoS Production Into The US, Pivotal Moment For The AI Markets 1

TSMC and Amkor Technologies are working to bring advanced chip packaging technology to the US, with Taiwan's giant Arizona facility playing a significant role. TSMC's Arizona Facility To Be Responsible For Chip Packaging Production, AI Hardware Manufacturers To Benefit Tremendously [Press Release]: Amkor Technology, Inc and TSMC announced today that the two companies have signed a memorandum of understanding to collaborate and bring advanced packaging and test capabilities to Arizona, further expanding the region’s semiconductor ecosystem. Amkor and TSMC have been closely collaborating to deliver high volume, leading-edge technologies for advanced packaging and testing of semiconductors to support critical markets such as high-performance […]

Read full article at https://wccftech.com/tsmc-us-based-amkor-technologies-bring-cowos-production-into-us/

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