TSMC plans to introduce next-gen CoW-SoW (System-on-Wafer) advanced packaging technology by 2027, enabling the development of gigantic chips. TSMC Plans To Lead The Future of Packaging Technology Through CoW-SoW, Allowing Development Of Huge AI & Data Center Chips With the demands of the AI industry rapidly evolving, the need for innovation in the supply chain is now more desperate than ever, which is why companies like TSMC are in pursuit of integrating new technologies into existing products. Ctee is now reporting that the Taiwan giant plans to develop a new "CoW-SoW" advanced packaging technology, which is said to stack memory […]
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