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Slitterhead – How to Get Rarity Edo to Unlock Hidden Cave RE 2nd Loop Mission

Much of the Slitterhead gameplay revolves around Rarities, gifted humans who can achieve higher attunement with the mysterious Night Owl and maintain their consciousness while being possessed, which allows them to use some unique fighting styles and skills that can make your life easier against all sorts of opponents. Unlock new Rarities is also a necessity to proceed in the main campaign, as you will need the help of specific characters to continue Night Owl's war against Slitterheads. The first time this happens is right after starting to investigate a religious cult that seems to be bringing together monsters and […]

A Primer On The Tech Policies Championed By The Trump And Harris Campaigns

With one of the most fractious, ruthless, and discordant federal elections in living memory just around the corner, the politics across wide swathes of the U.S. remains hopelessly divided. Yet, judging each presidential candidate strictly on policy proposals represents one of the only few systematic methods of sifting through personal and groupthink biases, which in turn paves the way for decisions that are rational and grounded in facts. The tech sector constitutes an integral component of not just the market but the economy as a whole. Add in the escalation of Artificial Intelligence (AI) in nearly every domain, and tech […]

AMD’s “Strix Point” Ryzen AI 9 HX 370 APU Handheld Gets Tested, Achieving 50-60 FPS At Black Myth: Wukong Under 15W TDP

AMD's flagship "Strix Point" Ryzen AI 9 HX 370 has now been tested on One-Netbook's newest ONEXFLY F1 Pro handheld, revealing impressive performance for a compact device. ONEXFLY F1 Pro Becomes The First Handheld To Feature AMD's Ryzen AI 9 HX 370 APU, Bringing In High-End Gaming Performance AMD's "Ryzen AI 300" series has seen decent adoption from the laptop segment, given its impressive performance capabilities and AI computational power; however, in terms of the handheld market, the integration of Strix Point APUs has been a slowed one, especially with the flagship Ryzen AI 9 HX 370, since One-Netbook is […]

Slitterhead – How to Easily Defeat Special Forces Unit Members

In Slitterhead, Hyoki and his Rarities will have to fight a variety of enemies of the supernatural kind, but there will be times when regular old humans will get in their way, leaving them no choice but to use their special powers to take them out and continue their hunt for the vicious Slitterheads. These humans, however, are very different from the Civilians that Hyoki can possess and will fight back with everything they got. During the Oppressive Force mission, you will encounter members of the S.P.E.U., a military unit out to destroy not only Slitterheads but also Hyoki. Dealing […]

SK hynix’s 1c “6th Gen 10nm” Node Leveraged By 16Gb DDR5 & Headed To LPDDR6, HBM & GDDR7

SK hynix has developed the world's first DDR5 memory with the 1c "6th Gen 10nm" node & will also bring it to HBM, LPDDR6 & GDDR7 products. World's First 1c DDR5 Memory Developed By SK Hynix, Offers 11% Speed-Up & Up To 8000 MT/s Speeds Press Release: SK hynix Inc. announced today that it had developed the industry’s first 16Gb DDR5 built using its 1c node, the sixth generation of the 10nm process. The success marks the beginning of the extreme scaling to the level closer to 10nm in the memory process technology. 1c node, 6th generation of 10nm process, […]

SK hynix HBM4 Memory To Tape-Out In October, Cooking For Next-Gen Rubin AI Chips

SK hynix is aiming the tape-out of its HBM4 memory by October and will go on to power NVIDIA's next-gen Rubin AI chips. SK hynix's HBM4 memory for the next-gen NVIDIA AI Chips will be ready to tape out in October SK Hynix, a key player in supplying HBM (High Bandwidth Memory) to NVIDIA has set its plans to 'tape-out' the HBM4 memory for next-gen NVIDIA AI chips. As per the report, the company has also prepared for HBM4 tape-out for AMD AI chips but only after a few months. ZDNet reports that the 6th generation HBM memory is nearing […]

SK hynix Proposes Development of Next-Gen HBM Memory Standard With 30x Performance Uplift Versus Current Gen

SK hynix plans to develop a new HBM memory standard which will be 30x faster than modern-day HBM products, to gain the lead in the competitive HBM market. SK Hynix Is Set To Take Competition In HBM Markets To New Heights With Next-Gen Products, Offering Up To 30x Speedups Speaking at the SK Icheon Forum 2024, Vice President of SK Hynix Ryu Seong-su disclosed that the Korean giant has huge ambitions for the HBM markets, claiming that the firm is working towards rapidly innovating the segment by introducing high-end next-gen HBM memory products. The official stated that the upcoming HBM […]

Samsung’s Next-Gen HBM4 Memory To Enter Mass Production By End-2025, Tape-Out To Be Achieved Next Quarter

Samsung looks to take the lead in the next-gen HBM4 memory markets, as the Korean giant is set to tape out the cutting-edge tech by the end of this year. Samsung's HBM4 Memory Is Expected To Come Head-To-Head With SK hynix's Counterpart; Competition Will Be Fiercer This Time The HBM industry is growing rapidly under the AI hype, with demand skyrocketing to new levels. This has prompted firms like Samsung and SK hynix to evolve their HBM products to cater to the fuel of innovation that is currently at its peak in the markets. Interestingly, we never really had an […]

Huawei To Establish HBM Production Lines By 2026, Collaborates With YMTC’s Subsidiary & Domestic Semiconductor Firms

Huawei plans to enter the booming "HBM business" and capitalize on the AI hype by collaborating with Wuhan XMC, a domestic semiconductor firm. Huawei & Co. Looks To Step Into The HBM Markets To Capitalize On The AI Hype, Plans To Reach Production By 2026 The HBM business is booming; there's no doubt about that. Every other memory firm, whether Samsung or SK hynix, is engaged in an HBM race, battling against each other to win as many orders as possible. The reason behind the HBM boom is that the memory type plays a crucial role in its integration at […]

SK hynix To Integrate Computing & Caching Functionalities With Next-Gen HBM4E Memory

SK hynix looks to take the HBM industry to a new level, as the firm plans to integrate additional functionalities in its next-gen HBM4E memory. SK hynix's Idea Of Merging Semiconductor & HBM Into A Single Package Is Still Relevant, As The Firm Plans To Move One Step Ahead With HBM4E With the competition in the HBM markets being more fierce than ever, it seems like the Korean manufacturer has found a way to stand out among others, and they plan on doing so by introducing an HBM type that can allow multiple functionalities such as computing, cache, and network […]

HBM Market To Witness Price Surge Up To 10% By 2025 As Demand Set To Double Next Year

The AI hype has taken HBM demand to new heights and is expected to double by next year along with significant price hikes of up to 10%. Hunger For AI Computing Power Has Led HBM Supply To Grow Rapidly, Unit Prices Soar To New Levels Research outlet, TrendForce reports that the memory industry has immensely benefited from the demand for AI-focused activities, with HBM sales playing a vital role in reviving the markets. Avril Wu, TrendForce's Senior Research Vice President, has disclosed that HBM has witnessed a colossal soar in revenue share in the memory industry, outperforming both consumer and […]

SK hynix Reports That Its 2025 HBM Volume Is Almost Sold Out, 12-Hi HBM3E Production Next Quarter, 16-Hi HBM4 In 2028

SK hynix has highlighted that not only its 2024 but almost all of its 2025 HBM volume has been sold out as demand for AI reaches sky-high. SK hynix Has Almost The Entirety of Its 2025 HBM Volume Sold Out, 12-Hi HBM3E Being Sampled & Ready For Production In Q3 2024 During its recent press conference, SK hynix announced plans to invest in a new M15X fab in the Cheongju and the Yongin Semiconductor Cluster in Korea along with advanced packaging facilities in the US (Indiana). SK hynix revealed that the growing demand for AI has exhausted all of its […]

DRAM Cache For GPUs Improves Performance By Up To 12.5x While Significantly Reducing Power Versus HBM

A new research paper has discovered the usefulness of DRAM cache for GPUs which can help enable higher performance at low power. Researchers Propose The Use Of Dedicated DRAM Caches Onto Newly-Built SCMs For GPUs, Replacing Conventional HBM Configuration The GPU industry, which involves consumer, workstation, and AI GPUs, is proceeding in a way that we are seeing advancements in memory capacities and bandwidth, but it isn't sustainable, and ultimately, we could hit the limits if an innovative approach isn't taken. We have seen GPU makers advance this segment by either incorporating large sums of secondary LLCs (Last Level Caches) […]

JEDEC Relaxes HBM4 Memory Thickness on Request of Major Manufacturers, Enables 16-Hi Stacks Within Existing Bonding Tech

JEDEC has reportedly provided relaxation for HBM4 memory participants, potentially allowing a more efficient development for 16-Hi designs. JEDEC Eases HBM4 Thickness Thresholds For Manufacturers Including Samsung, SK Hynix & Micron, Removing The Need For Hybrid Bonding Tech For 16-Hi Stacks HBM4 is the next big thing in the memory segment, with every firm involved in developing the memory type most effectively since it would ultimately set the course for success in the next-gen markets. To aid manufacturers, ZDNet Korea reports that JEDEC has decided to reduce the package thickness of HBM4 to 775 micrometers for both 12-layer and 16-layer […]

Micron’s Partnership With NVIDIA For H200 AI GPUs Shocks SK Hynix & Others In The HBM Race

Micron's recent partnership with NVIDIA has reportedly "shocked" others involved in the HBM race, as the firm manages to capture most of the spotlight. Micron's HBM3E Process Gains Superiority Over Competitors, As The Firm Becomes a Primary Supplier For NVIDIA's Next-Gen Products Korean media reports that Team Green's decision to opt for Micron's HBM3e process for its H200 AI GPU has stirred up a new debate among HBM manufacturers as Micron grasps the holy grail of next-gen markets. Micron's 24 GB 8H HBM3E will be part of NVIDIA's upcoming H200 AI accelerator, marking a massive achievement for the company, lagging […]

HBM Manufacturers Witnesses Low Yield Rates, Making It Difficult to Pass NVIDIA’s Qualification Tests

NVIDIA's qualification tests seem to be giving HBM manufacturers a hard time, as yield rates are significantly low compared to traditional memory products. HBM & Semiconductor Industry Sees a Common Enemy, As Low Yield Rates Raise Concerns On Production Volumes The issue of yield rates is common, mainly associated with semiconductor wafers when measured as the number of semiconductor chips produced from a single silicon wafer. Maintaining yield rates at an optimal level has been a huge concern and task for firms like TSMC and Samsung Foundry, but it seems like this issue has also crawled into the HBM industry. […]

Tag: HBM

DDR5 Gear 2 performs better than Gear 4 memory settings in both latency and performance departments on Intel Z890 motherboards. High memory frequency with DDR5 CUDIMM on Intel and AMD platforms doesn't favor performance or latency In recent weeks, we have seen a plethora of CUDIMMs being launched. Corsair, G.Skill, Colorful, and many more manufacturers introduced their own CUDIMM DDR5 memories for Intel's Z890 and AMD X870/X870E platforms that seek to enhance the overall performance of the system. Some overclockers already broke world records by breaking the 10000 MT/s and 12000 MT/s marks, but as we said previously, we are […]
Apple has recently announced the new M4 MacBook Pro models along with an upgraded iMac and a redesigned Mac mini. While the devices are pretty capable in terms of processing power, the company saw fit to keep the design language the same as previous models. The design is not bad, per se, but it has been running for the past few years. A prominent analyst now claims that Apple is working to introduce a redesigned MacBook Pro in 2026 with an OLED display, which will replace the mini-LED display on the current models. Apple's 2026 MacBook Pro models will feature […]

SK hynix’s 1c “6th Gen 10nm” Node Leveraged By 16Gb DDR5 & Headed To LPDDR6, HBM & GDDR7

SK hynix has developed the world's first DDR5 memory with the 1c "6th Gen 10nm" node & will also bring it to HBM, LPDDR6 & GDDR7 products. World's First 1c DDR5 Memory Developed By SK Hynix, Offers 11% Speed-Up & Up To 8000 MT/s Speeds Press Release: SK hynix Inc. announced today that it had developed the industry’s first 16Gb DDR5 built using its 1c node, the sixth generation of the 10nm process. The success marks the beginning of the extreme scaling to the level closer to 10nm in the memory process technology. 1c node, 6th generation of 10nm process, […]

SK hynix HBM4 Memory To Tape-Out In October, Cooking For Next-Gen Rubin AI Chips

SK hynix is aiming the tape-out of its HBM4 memory by October and will go on to power NVIDIA's next-gen Rubin AI chips. SK hynix's HBM4 memory for the next-gen NVIDIA AI Chips will be ready to tape out in October SK Hynix, a key player in supplying HBM (High Bandwidth Memory) to NVIDIA has set its plans to 'tape-out' the HBM4 memory for next-gen NVIDIA AI chips. As per the report, the company has also prepared for HBM4 tape-out for AMD AI chips but only after a few months. ZDNet reports that the 6th generation HBM memory is nearing […]

SK hynix Proposes Development of Next-Gen HBM Memory Standard With 30x Performance Uplift Versus Current Gen

SK hynix plans to develop a new HBM memory standard which will be 30x faster than modern-day HBM products, to gain the lead in the competitive HBM market. SK Hynix Is Set To Take Competition In HBM Markets To New Heights With Next-Gen Products, Offering Up To 30x Speedups Speaking at the SK Icheon Forum 2024, Vice President of SK Hynix Ryu Seong-su disclosed that the Korean giant has huge ambitions for the HBM markets, claiming that the firm is working towards rapidly innovating the segment by introducing high-end next-gen HBM memory products. The official stated that the upcoming HBM […]

Samsung’s Next-Gen HBM4 Memory To Enter Mass Production By End-2025, Tape-Out To Be Achieved Next Quarter

Samsung looks to take the lead in the next-gen HBM4 memory markets, as the Korean giant is set to tape out the cutting-edge tech by the end of this year. Samsung's HBM4 Memory Is Expected To Come Head-To-Head With SK hynix's Counterpart; Competition Will Be Fiercer This Time The HBM industry is growing rapidly under the AI hype, with demand skyrocketing to new levels. This has prompted firms like Samsung and SK hynix to evolve their HBM products to cater to the fuel of innovation that is currently at its peak in the markets. Interestingly, we never really had an […]

Huawei To Establish HBM Production Lines By 2026, Collaborates With YMTC’s Subsidiary & Domestic Semiconductor Firms

Huawei plans to enter the booming "HBM business" and capitalize on the AI hype by collaborating with Wuhan XMC, a domestic semiconductor firm. Huawei & Co. Looks To Step Into The HBM Markets To Capitalize On The AI Hype, Plans To Reach Production By 2026 The HBM business is booming; there's no doubt about that. Every other memory firm, whether Samsung or SK hynix, is engaged in an HBM race, battling against each other to win as many orders as possible. The reason behind the HBM boom is that the memory type plays a crucial role in its integration at […]

SK hynix To Integrate Computing & Caching Functionalities With Next-Gen HBM4E Memory

SK hynix looks to take the HBM industry to a new level, as the firm plans to integrate additional functionalities in its next-gen HBM4E memory. SK hynix's Idea Of Merging Semiconductor & HBM Into A Single Package Is Still Relevant, As The Firm Plans To Move One Step Ahead With HBM4E With the competition in the HBM markets being more fierce than ever, it seems like the Korean manufacturer has found a way to stand out among others, and they plan on doing so by introducing an HBM type that can allow multiple functionalities such as computing, cache, and network […]

HBM Market To Witness Price Surge Up To 10% By 2025 As Demand Set To Double Next Year

The AI hype has taken HBM demand to new heights and is expected to double by next year along with significant price hikes of up to 10%. Hunger For AI Computing Power Has Led HBM Supply To Grow Rapidly, Unit Prices Soar To New Levels Research outlet, TrendForce reports that the memory industry has immensely benefited from the demand for AI-focused activities, with HBM sales playing a vital role in reviving the markets. Avril Wu, TrendForce's Senior Research Vice President, has disclosed that HBM has witnessed a colossal soar in revenue share in the memory industry, outperforming both consumer and […]

SK hynix Reports That Its 2025 HBM Volume Is Almost Sold Out, 12-Hi HBM3E Production Next Quarter, 16-Hi HBM4 In 2028

SK hynix has highlighted that not only its 2024 but almost all of its 2025 HBM volume has been sold out as demand for AI reaches sky-high. SK hynix Has Almost The Entirety of Its 2025 HBM Volume Sold Out, 12-Hi HBM3E Being Sampled & Ready For Production In Q3 2024 During its recent press conference, SK hynix announced plans to invest in a new M15X fab in the Cheongju and the Yongin Semiconductor Cluster in Korea along with advanced packaging facilities in the US (Indiana). SK hynix revealed that the growing demand for AI has exhausted all of its […]

DRAM Cache For GPUs Improves Performance By Up To 12.5x While Significantly Reducing Power Versus HBM

A new research paper has discovered the usefulness of DRAM cache for GPUs which can help enable higher performance at low power. Researchers Propose The Use Of Dedicated DRAM Caches Onto Newly-Built SCMs For GPUs, Replacing Conventional HBM Configuration The GPU industry, which involves consumer, workstation, and AI GPUs, is proceeding in a way that we are seeing advancements in memory capacities and bandwidth, but it isn't sustainable, and ultimately, we could hit the limits if an innovative approach isn't taken. We have seen GPU makers advance this segment by either incorporating large sums of secondary LLCs (Last Level Caches) […]

JEDEC Relaxes HBM4 Memory Thickness on Request of Major Manufacturers, Enables 16-Hi Stacks Within Existing Bonding Tech

JEDEC has reportedly provided relaxation for HBM4 memory participants, potentially allowing a more efficient development for 16-Hi designs. JEDEC Eases HBM4 Thickness Thresholds For Manufacturers Including Samsung, SK Hynix & Micron, Removing The Need For Hybrid Bonding Tech For 16-Hi Stacks HBM4 is the next big thing in the memory segment, with every firm involved in developing the memory type most effectively since it would ultimately set the course for success in the next-gen markets. To aid manufacturers, ZDNet Korea reports that JEDEC has decided to reduce the package thickness of HBM4 to 775 micrometers for both 12-layer and 16-layer […]

Micron’s Partnership With NVIDIA For H200 AI GPUs Shocks SK Hynix & Others In The HBM Race

Micron's recent partnership with NVIDIA has reportedly "shocked" others involved in the HBM race, as the firm manages to capture most of the spotlight. Micron's HBM3E Process Gains Superiority Over Competitors, As The Firm Becomes a Primary Supplier For NVIDIA's Next-Gen Products Korean media reports that Team Green's decision to opt for Micron's HBM3e process for its H200 AI GPU has stirred up a new debate among HBM manufacturers as Micron grasps the holy grail of next-gen markets. Micron's 24 GB 8H HBM3E will be part of NVIDIA's upcoming H200 AI accelerator, marking a massive achievement for the company, lagging […]

HBM Manufacturers Witnesses Low Yield Rates, Making It Difficult to Pass NVIDIA’s Qualification Tests

NVIDIA's qualification tests seem to be giving HBM manufacturers a hard time, as yield rates are significantly low compared to traditional memory products. HBM & Semiconductor Industry Sees a Common Enemy, As Low Yield Rates Raise Concerns On Production Volumes The issue of yield rates is common, mainly associated with semiconductor wafers when measured as the number of semiconductor chips produced from a single silicon wafer. Maintaining yield rates at an optimal level has been a huge concern and task for firms like TSMC and Samsung Foundry, but it seems like this issue has also crawled into the HBM industry. […]

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