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Apple Officially Releases macOS Sequoia With iPhone Mirroring And More – Check Out The Complete Changelog

Wccftech.com - 0
Apple has released macOS Sequoia to the general public with a handful of changes, and it will be the first stepping stone for Apple Intelligence. If you are a developer or an average user, macOS Sequoia can be downloaded and installed right now on all compatible Macs. Apple has released macOS Sequoia to the general public for all compatible Macs If you are not familiar with the mechanism, macOS Sequoia can be downloaded through the Software Update section in System Settings. Note that the latest release comes with a handful of AI features, but the company will release dedicated Apple […]
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Bungie’s Marathon Appears To Be Targeting $40 Launch Price

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Marathon, Bungie's new project, supposedly targets a $40 launch price. Marathon is an upcoming PvP extraction shooter originally revealed in May 2023. Sources have reportedly spoken to The Game Post about the upcoming title and that they're considering a $40 launch price for Marathon. This suggests that Bungie is opting for the game to be a pay-to-play premium model rather than free-to-play with microtransactions, as seen in plenty of current games, including their well-known Destiny 2. Recently, Bungie and Sony have discussed Marathon's pricing strategy and how they will approach it. Conversations and an extended dialogue likely happened once Sony's […]
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Download: Apple Has Released The Final Version Of watchOS 11 For Apple Watch – Changelog

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Apple has released the final version of watchOS 11 to the general public, which comes with a boatload of new additions and changes. The update is finally out of its beta cycle, and users can download it right now on their compatible Apple Watch models. Check out how you can download watchOS 11 on your Apple Watch right now. Apple released watchOS 11 to the general public for all compatible Apple Watch models watchOS 11 release brings a handful of front-facing additions which you can check out after installing the update. If you are new to the Apple ecosystem, watchOS […]
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Download: Apple Has Released iOS 18 Update To The General Public With Major Features

Also releasing today: New iOS 17, macOS 14 updates for the upgrade-averse

Also releasing today: New iOS 17, macOS 14 updates for the upgrade-averse

9-Minute Starfield Deep Dive Gives A Tour Of The Expansion’s New ‘Handcrafted’ Planet

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JEDEC Moving Towards HBM4 Spec Finalization: Up To 32 Gb Densities In 16-Hi TSV Stacks, 6.4 Gbps Speeds

Wccftech.com - 0
JEDEC has unveiled the initial specifications of HBM4 as the highly anticipated memory standard nears completion & ultimately enters mass production. HBM4 Is Set To Bring In Massive Memory Capacities, Up To 32 Gb Densities In 16-Hi Stacks The semiconductor and memory industries are all focused on HBM4, the memory type expected to elevate the performance of associated products to new levels. The HBM adoption rate has soared massively in the past year simply due to the demand from the AI markets for products utilizing the memory type, such as AI accelerators. This has not only fueled firms to upscale […]
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SK hynix To Integrate Computing & Caching Functionalities With Next-Gen HBM4E Memory

Wccftech.com - 0
SK hynix looks to take the HBM industry to a new level, as the firm plans to integrate additional functionalities in its next-gen HBM4E memory. SK hynix's Idea Of Merging Semiconductor & HBM Into A Single Package Is Still Relevant, As The Firm Plans To Move One Step Ahead With HBM4E With the competition in the HBM markets being more fierce than ever, it seems like the Korean manufacturer has found a way to stand out among others, and they plan on doing so by introducing an HBM type that can allow multiple functionalities such as computing, cache, and network […]
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Samsung & SK hynix Eye 1c DRAM As The Choice For HBM4 Memory, TSMC Preps HBM4 Base Dies On 12nm & 5nm

Wccftech.com - 0
Development on the next-gen HBM4 memory standard is in full swing as TSMC, Samsung & SK hynix prep the latest DRAM & process nodes. TSMC Brings Forward 12nm & 5nm Nodes For HBM4 Memory Base Dies, Samsung & SK hynix Go 1c DRAM Route Both Samsung and SK hynix are in the race to offer the next-generation HBM4 memory standard. The Korean giants have shown their initial plans for a 2025-2026 debut. Samsung has so far eyed the use of 3D Packaging technologies and up to 16-Hi stacks for an unprecedented increase in the VRAM capacities and memory bandwidth while […]
Read more
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SK Hynix Reveals Plans For Cutting-Edge HBM4E Memory, Development Expected By 2026

Wccftech.com - 0
The massive HBM industry growth has initiated the "fire" of innovations, with the Korean giant SK hynix revealing plans for HBM4E memory. SK Hynix Looks To Establish New Benchmarks With HBM4E Through Integration of Semiconductors & Memory Into One Package Right now, the AI industry sees HBM as a crucial component for progress in performance capabilities due to its immense importance in modern-day AI accelerators. Recently, we saw the widespread adoption of the HBM3E standard in newer AI GPUs such as the Blackwell B100 and the Instinct MI300X, which brought in a huge boost in performances; however, SK hynix has […]
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SK hynix Reports That Its 2025 HBM Volume Is Almost Sold Out, 12-Hi HBM3E Production Next Quarter, 16-Hi HBM4 In 2028

Wccftech.com - 0
SK hynix has highlighted that not only its 2024 but almost all of its 2025 HBM volume has been sold out as demand for AI reaches sky-high. SK hynix Has Almost The Entirety of Its 2025 HBM Volume Sold Out, 12-Hi HBM3E Being Sampled & Ready For Production In Q3 2024 During its recent press conference, SK hynix announced plans to invest in a new M15X fab in the Cheongju and the Yongin Semiconductor Cluster in Korea along with advanced packaging facilities in the US (Indiana). SK hynix revealed that the growing demand for AI has exhausted all of its […]
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SK Hynix Partners With TSMC On HBM4 Memory & Next-Gen Packaging Technology Development, Eyes 2026 Release

Wccftech.com - 0
SK hynix has announced its partnership with TSMC for the development of next-gen HBM4 memory and packaging technologies such as CoWoS 2. SK hynix Enters The HBM4 Memory Race: Partners With TSMC For Next-Gen Memory & Packaging Innovations The announcement from SK hynix comes just a day after Samsung announced that it has kicked of its very own HBM4 memory development and eyes release in 2025. In that regard, the company will be ready with HBM4 by 2026 for official volume release and we can expect them to also feature some extravagant speeds with higher memory capacities achieved through using […]
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Samsung HBM4 Memory In Development For 2025 Debut: 16-Hi Stacks & 3D Packaging

Wccftech.com - 0
Samsung has announced the development of its next-gen HBM4 memory which will debut in 2025 with some grand specs and features. Samsung's Next-Gen HBM4 Memory To Offer Increased Capacities, Increased Speeds & Should Utilize 3D Packaging Technology In a blog post by the Korean semiconductor manufacturer, Samsung once again reaffirmed that its HBM4 memory is currently in development and should debut in 2025. The company's current HBM portfolio includes the HBM3E "Shinebolt" as the top offering, featuring up to 36 GB capacities using 24 Gb DRAM and up to 9.8 Gbps transfer speeds. The memory technology supports stacks up to […]
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JEDEC Relaxes HBM4 Memory Thickness on Request of Major Manufacturers, Enables 16-Hi Stacks Within Existing Bonding Tech

Wccftech.com - 0
JEDEC has reportedly provided relaxation for HBM4 memory participants, potentially allowing a more efficient development for 16-Hi designs. JEDEC Eases HBM4 Thickness Thresholds For Manufacturers Including Samsung, SK Hynix & Micron, Removing The Need For Hybrid Bonding Tech For 16-Hi Stacks HBM4 is the next big thing in the memory segment, with every firm involved in developing the memory type most effectively since it would ultimately set the course for success in the next-gen markets. To aid manufacturers, ZDNet Korea reports that JEDEC has decided to reduce the package thickness of HBM4 to 775 micrometers for both 12-layer and 16-layer […]
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TSMC & SK hynix Form Strategic AI Alliance, Fueling HBM4 For Next-Gen NVIDIA & AMD GPUs

Wccftech.com - 0
TSMC and SK hynix, are reportedly forming an AI alliance to progress together into the future which will be accelerated with HBM4 development for NVIDIA & AMD's next-gen GPUs. TSMC and SK hynix Reportedly See Samsung Electronics As a Threat To Their Market Presence, Will Fast-Forward HBM4 Which Will First Be Used In Next-Gen NVIDIA GPUs Right now, the AI industry is dynamically evolving, and when it comes to the financial side of things, the revenue figures we are seeing right now have attracted every major tech firm you could think of. TSMC and SK hynix are two major players […]
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SK hynix Announces Mass-Production of HBM4 By 2026, Primed For Next-Gen AI GPUs

Wccftech.com - 0
SK hynix has announced mass production of the next-generation HBM4 memory, expected to commence by 2026. SK hynix Joins The Likes of Samsung & Micron in HBM4 Race, Targeting a Similar Mass Production Timeline So far, we have seen Micron & Samsung list their next-generation HBM4 memory products while confirming the development. These two companies have highlighted a launch timeframe of around 2025-2026, and it looks like SK hynix has also joined the game. With the rapid increase in the adoption of AI in the markets, there is demand for more enhanced computing power as we move into the future, and it is […]
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SK hynix Confirms HBM4 High-Bandwidth Memory Development Begins In 2024

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SK hynix has confirmed in a blog post that the development of its next-generation HBM4 high-bandwidth memory commences in 2024. SK hynix To Begin Development of Next-Gen HBM4 High-Bandwidth Memory In 2024, To Power The Next Era of Data Centers & AI So far, we have seen Micron & Samsung list down their next-generation HBM4 memory products while also confirming the development. These two companies have highlighted a launch timeframe of around 2025-2026. Based on the latest confirmation from SK hynix, the company has also unveiled that it plans to commence production of the next generation of high-bandwidth memory in […]
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NVIDIA to Initiate HBM3e Adoption In Q1 2024 With Hopper H200, HBM4 Expected to Debut by 2026

Wccftech.com - 0
It looks like the HBM industry has centered itself around NVIDIA, as TrendForce estimates a market, where NVIDIA's AI orders dominate current and next-gen HBM supply. NVIDIA Plans on Dominating The AI Markets By Utilization of Next-Gen HBM Memory, Suppliers Start Revolving Around Team Green According to market research, NVIDIA is all set to give a fair portion of its HBM orders to the Korean giant Samsung, as both companies start to build on business ties that could prove to be vital for the AI industry. It was reported back in September that Samsung has managed to gain the trust […]
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Tag: HBM4

Intel Officially Manages To Get A New Financial Lifeline Through CHIPS Act, Gets Additional $3 Billion In Direct Funding

News
After weeks of urgent negotiations, Intel has finally managed to receive additional grants under the US CHIPS Act, awarded up to a total of $3 billion in direct funding. Intel Receives New Grants By The Biden Administration To Ensure Chipmaker's Growth & Sustainability [Press Release]: The Biden-Harris Administration announced today that Intel Corporation has been awarded up to $3 billion in direct funding under the CHIPS and Science Act for the Secure Enclave program. The program is designed to expand the trusted manufacturing of leading-edge semiconductors for the U.S. government. The Secure Enclave program builds on previous projects between Intel and […]

Super Micro Computer (SMCI) Is Likely To Disclose Its Annual Report Today After Hindenburg’s Short Attack In August Prompted An Internal Review

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Super Micro Computer (NASDAQ: SMCI), a retailer of high-performance servers and liquid-cooled AI racks, set the proverbial tongues wagging back in August when it delayed the disclosure of its requisite annual report just a day after a high-profile attack from the prolific short-seller Hindenburg Research. Now, after exhausting a statutory facility that allows for a 15-day extension, the company has to file its delayed annual report for its FY 2024 by today. For the benefit of those who might not be aware, Hindenburg Research leveled three primary allegations against Super Micro Computer: SMCI sales team allegedly stuffs its distribution channel […]

JEDEC Moving Towards HBM4 Spec Finalization: Up To 32 Gb Densities In 16-Hi TSV Stacks, 6.4 Gbps Speeds

News
JEDEC has unveiled the initial specifications of HBM4 as the highly anticipated memory standard nears completion & ultimately enters mass production. HBM4 Is Set To Bring In Massive Memory Capacities, Up To 32 Gb Densities In 16-Hi Stacks The semiconductor and memory industries are all focused on HBM4, the memory type expected to elevate the performance of associated products to new levels. The HBM adoption rate has soared massively in the past year simply due to the demand from the AI markets for products utilizing the memory type, such as AI accelerators. This has not only fueled firms to upscale […]

SK hynix To Integrate Computing & Caching Functionalities With Next-Gen HBM4E Memory

News
SK hynix looks to take the HBM industry to a new level, as the firm plans to integrate additional functionalities in its next-gen HBM4E memory. SK hynix's Idea Of Merging Semiconductor & HBM Into A Single Package Is Still Relevant, As The Firm Plans To Move One Step Ahead With HBM4E With the competition in the HBM markets being more fierce than ever, it seems like the Korean manufacturer has found a way to stand out among others, and they plan on doing so by introducing an HBM type that can allow multiple functionalities such as computing, cache, and network […]

Samsung & SK hynix Eye 1c DRAM As The Choice For HBM4 Memory, TSMC Preps HBM4 Base Dies On 12nm & 5nm

News
Development on the next-gen HBM4 memory standard is in full swing as TSMC, Samsung & SK hynix prep the latest DRAM & process nodes. TSMC Brings Forward 12nm & 5nm Nodes For HBM4 Memory Base Dies, Samsung & SK hynix Go 1c DRAM Route Both Samsung and SK hynix are in the race to offer the next-generation HBM4 memory standard. The Korean giants have shown their initial plans for a 2025-2026 debut. Samsung has so far eyed the use of 3D Packaging technologies and up to 16-Hi stacks for an unprecedented increase in the VRAM capacities and memory bandwidth while […]

SK Hynix Reveals Plans For Cutting-Edge HBM4E Memory, Development Expected By 2026

News
The massive HBM industry growth has initiated the "fire" of innovations, with the Korean giant SK hynix revealing plans for HBM4E memory. SK Hynix Looks To Establish New Benchmarks With HBM4E Through Integration of Semiconductors & Memory Into One Package Right now, the AI industry sees HBM as a crucial component for progress in performance capabilities due to its immense importance in modern-day AI accelerators. Recently, we saw the widespread adoption of the HBM3E standard in newer AI GPUs such as the Blackwell B100 and the Instinct MI300X, which brought in a huge boost in performances; however, SK hynix has […]

SK hynix Reports That Its 2025 HBM Volume Is Almost Sold Out, 12-Hi HBM3E Production Next Quarter, 16-Hi HBM4 In 2028

News
SK hynix has highlighted that not only its 2024 but almost all of its 2025 HBM volume has been sold out as demand for AI reaches sky-high. SK hynix Has Almost The Entirety of Its 2025 HBM Volume Sold Out, 12-Hi HBM3E Being Sampled & Ready For Production In Q3 2024 During its recent press conference, SK hynix announced plans to invest in a new M15X fab in the Cheongju and the Yongin Semiconductor Cluster in Korea along with advanced packaging facilities in the US (Indiana). SK hynix revealed that the growing demand for AI has exhausted all of its […]

SK Hynix Partners With TSMC On HBM4 Memory & Next-Gen Packaging Technology Development, Eyes 2026 Release

News
SK hynix has announced its partnership with TSMC for the development of next-gen HBM4 memory and packaging technologies such as CoWoS 2. SK hynix Enters The HBM4 Memory Race: Partners With TSMC For Next-Gen Memory & Packaging Innovations The announcement from SK hynix comes just a day after Samsung announced that it has kicked of its very own HBM4 memory development and eyes release in 2025. In that regard, the company will be ready with HBM4 by 2026 for official volume release and we can expect them to also feature some extravagant speeds with higher memory capacities achieved through using […]

Samsung HBM4 Memory In Development For 2025 Debut: 16-Hi Stacks & 3D Packaging

News
Samsung has announced the development of its next-gen HBM4 memory which will debut in 2025 with some grand specs and features. Samsung's Next-Gen HBM4 Memory To Offer Increased Capacities, Increased Speeds & Should Utilize 3D Packaging Technology In a blog post by the Korean semiconductor manufacturer, Samsung once again reaffirmed that its HBM4 memory is currently in development and should debut in 2025. The company's current HBM portfolio includes the HBM3E "Shinebolt" as the top offering, featuring up to 36 GB capacities using 24 Gb DRAM and up to 9.8 Gbps transfer speeds. The memory technology supports stacks up to […]

JEDEC Relaxes HBM4 Memory Thickness on Request of Major Manufacturers, Enables 16-Hi Stacks Within Existing Bonding Tech

News
JEDEC has reportedly provided relaxation for HBM4 memory participants, potentially allowing a more efficient development for 16-Hi designs. JEDEC Eases HBM4 Thickness Thresholds For Manufacturers Including Samsung, SK Hynix & Micron, Removing The Need For Hybrid Bonding Tech For 16-Hi Stacks HBM4 is the next big thing in the memory segment, with every firm involved in developing the memory type most effectively since it would ultimately set the course for success in the next-gen markets. To aid manufacturers, ZDNet Korea reports that JEDEC has decided to reduce the package thickness of HBM4 to 775 micrometers for both 12-layer and 16-layer […]

TSMC & SK hynix Form Strategic AI Alliance, Fueling HBM4 For Next-Gen NVIDIA & AMD GPUs

News
TSMC and SK hynix, are reportedly forming an AI alliance to progress together into the future which will be accelerated with HBM4 development for NVIDIA & AMD's next-gen GPUs. TSMC and SK hynix Reportedly See Samsung Electronics As a Threat To Their Market Presence, Will Fast-Forward HBM4 Which Will First Be Used In Next-Gen NVIDIA GPUs Right now, the AI industry is dynamically evolving, and when it comes to the financial side of things, the revenue figures we are seeing right now have attracted every major tech firm you could think of. TSMC and SK hynix are two major players […]

SK hynix Announces Mass-Production of HBM4 By 2026, Primed For Next-Gen AI GPUs

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SK hynix has announced mass production of the next-generation HBM4 memory, expected to commence by 2026. SK hynix Joins The Likes of Samsung & Micron in HBM4 Race, Targeting a Similar Mass Production Timeline So far, we have seen Micron & Samsung list their next-generation HBM4 memory products while confirming the development. These two companies have highlighted a launch timeframe of around 2025-2026, and it looks like SK hynix has also joined the game. With the rapid increase in the adoption of AI in the markets, there is demand for more enhanced computing power as we move into the future, and it is […]

SK hynix Confirms HBM4 High-Bandwidth Memory Development Begins In 2024

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SK hynix has confirmed in a blog post that the development of its next-generation HBM4 high-bandwidth memory commences in 2024. SK hynix To Begin Development of Next-Gen HBM4 High-Bandwidth Memory In 2024, To Power The Next Era of Data Centers & AI So far, we have seen Micron & Samsung list down their next-generation HBM4 memory products while also confirming the development. These two companies have highlighted a launch timeframe of around 2025-2026. Based on the latest confirmation from SK hynix, the company has also unveiled that it plans to commence production of the next generation of high-bandwidth memory in […]

NVIDIA to Initiate HBM3e Adoption In Q1 2024 With Hopper H200, HBM4 Expected to Debut by 2026

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It looks like the HBM industry has centered itself around NVIDIA, as TrendForce estimates a market, where NVIDIA's AI orders dominate current and next-gen HBM supply. NVIDIA Plans on Dominating The AI Markets By Utilization of Next-Gen HBM Memory, Suppliers Start Revolving Around Team Green According to market research, NVIDIA is all set to give a fair portion of its HBM orders to the Korean giant Samsung, as both companies start to build on business ties that could prove to be vital for the AI industry. It was reported back in September that Samsung has managed to gain the trust […]
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