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Samsung’s Galaxy Watch 7 with LTE connectivity hits $300 Amazon low today, more up to $167 off

9to5Toys.com - 0
We have been tracking some solid price drops on Samsung’s new Galaxy Watch 7 wearables over the last few weeks, but Amazon is now offering its best prices yet on the most affordable LTE-ready models alongside ongoing discounts across the rest of the co...
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Logitech’s new G309 LIGHTSPEED wireless gaming mouse is down to $70 today

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We are now tracking a deal that drops Logitech’s new G309 LIGHTSPEED gaming mouse in black to $69.99 shipped on Amazon. This is a fairly new unit that debuted a few months back in July this year carrying an $80 price tag. We saw the white variant of th...
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Bloodborne Can Run At 4K Resolution, 100 FPS on an RTX 4070 With ShadPS4 Emulator Latest Version

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The latest version of the ShadPS4 emulator continues to improve Bloodborne's performance on PC, fixing a critical issue and more. As showcased by GAMESMARK in a new video, version 0.4.1 of the emulator, which is not yet available to the public, runs the game with full audio and no longer requires a mod workaround to work properly. Performance seems to be extremely solid as well, as the game runs at 4K resolution and around 100 FPS on a system powered by an AMD Ryzen 5 7600X CPU, an RTX 4070 GPU, and 32 GB of DDR5 RAM. The latest public […]
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First Amazon price drops on the new M4 Mac mini now live, but you might be better off at Best Buy

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We aren’t talking about massive price drops here, and nothing quite as good as the elevated trade-in values we featured at Best Buy, but Amazon has shaved the MSRP on Apple’s new M4 Mac mini ahead of release this week. If you have gear to trade-in for ...

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Samsung’s Next-Gen HBM4 Memory To Enter Mass Production By End-2025, Tape-Out To Be Achieved Next Quarter

Wccftech.com - 0
Samsung looks to take the lead in the next-gen HBM4 memory markets, as the Korean giant is set to tape out the cutting-edge tech by the end of this year. Samsung's HBM4 Memory Is Expected To Come Head-To-Head With SK hynix's Counterpart; Competition Will Be Fiercer This Time The HBM industry is growing rapidly under the AI hype, with demand skyrocketing to new levels. This has prompted firms like Samsung and SK hynix to evolve their HBM products to cater to the fuel of innovation that is currently at its peak in the markets. Interestingly, we never really had an […]
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JEDEC Moving Towards HBM4 Spec Finalization: Up To 32 Gb Densities In 16-Hi TSV Stacks, 6.4 Gbps Speeds

Wccftech.com - 0
JEDEC has unveiled the initial specifications of HBM4 as the highly anticipated memory standard nears completion & ultimately enters mass production. HBM4 Is Set To Bring In Massive Memory Capacities, Up To 32 Gb Densities In 16-Hi Stacks The semiconductor and memory industries are all focused on HBM4, the memory type expected to elevate the performance of associated products to new levels. The HBM adoption rate has soared massively in the past year simply due to the demand from the AI markets for products utilizing the memory type, such as AI accelerators. This has not only fueled firms to upscale […]
Read more
News

Samsung & SK hynix Eye 1c DRAM As The Choice For HBM4 Memory, TSMC Preps HBM4 Base Dies On 12nm & 5nm

Wccftech.com - 0
Development on the next-gen HBM4 memory standard is in full swing as TSMC, Samsung & SK hynix prep the latest DRAM & process nodes. TSMC Brings Forward 12nm & 5nm Nodes For HBM4 Memory Base Dies, Samsung & SK hynix Go 1c DRAM Route Both Samsung and SK hynix are in the race to offer the next-generation HBM4 memory standard. The Korean giants have shown their initial plans for a 2025-2026 debut. Samsung has so far eyed the use of 3D Packaging technologies and up to 16-Hi stacks for an unprecedented increase in the VRAM capacities and memory bandwidth while […]
Read more
News

SK Hynix Partners With TSMC On HBM4 Memory & Next-Gen Packaging Technology Development, Eyes 2026 Release

Wccftech.com - 0
SK hynix has announced its partnership with TSMC for the development of next-gen HBM4 memory and packaging technologies such as CoWoS 2. SK hynix Enters The HBM4 Memory Race: Partners With TSMC For Next-Gen Memory & Packaging Innovations The announcement from SK hynix comes just a day after Samsung announced that it has kicked of its very own HBM4 memory development and eyes release in 2025. In that regard, the company will be ready with HBM4 by 2026 for official volume release and we can expect them to also feature some extravagant speeds with higher memory capacities achieved through using […]
Read more
News

Samsung HBM4 Memory In Development For 2025 Debut: 16-Hi Stacks & 3D Packaging

Wccftech.com - 0
Samsung has announced the development of its next-gen HBM4 memory which will debut in 2025 with some grand specs and features. Samsung's Next-Gen HBM4 Memory To Offer Increased Capacities, Increased Speeds & Should Utilize 3D Packaging Technology In a blog post by the Korean semiconductor manufacturer, Samsung once again reaffirmed that its HBM4 memory is currently in development and should debut in 2025. The company's current HBM portfolio includes the HBM3E "Shinebolt" as the top offering, featuring up to 36 GB capacities using 24 Gb DRAM and up to 9.8 Gbps transfer speeds. The memory technology supports stacks up to […]
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News

JEDEC Relaxes HBM4 Memory Thickness on Request of Major Manufacturers, Enables 16-Hi Stacks Within Existing Bonding Tech

Wccftech.com - 0
JEDEC has reportedly provided relaxation for HBM4 memory participants, potentially allowing a more efficient development for 16-Hi designs. JEDEC Eases HBM4 Thickness Thresholds For Manufacturers Including Samsung, SK Hynix & Micron, Removing The Need For Hybrid Bonding Tech For 16-Hi Stacks HBM4 is the next big thing in the memory segment, with every firm involved in developing the memory type most effectively since it would ultimately set the course for success in the next-gen markets. To aid manufacturers, ZDNet Korea reports that JEDEC has decided to reduce the package thickness of HBM4 to 775 micrometers for both 12-layer and 16-layer […]
Read more
News

SK hynix Confirms HBM4 High-Bandwidth Memory Development Begins In 2024

Wccftech.com - 0
SK hynix has confirmed in a blog post that the development of its next-generation HBM4 high-bandwidth memory commences in 2024. SK hynix To Begin Development of Next-Gen HBM4 High-Bandwidth Memory In 2024, To Power The Next Era of Data Centers & AI So far, we have seen Micron & Samsung list down their next-generation HBM4 memory products while also confirming the development. These two companies have highlighted a launch timeframe of around 2025-2026. Based on the latest confirmation from SK hynix, the company has also unveiled that it plans to commence production of the next generation of high-bandwidth memory in […]
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Tag: HBM4 Memory

UGREEN early Black Friday sale now live with up to 47% off Qi2 MagSafe gear, power banks, bundle deals, more

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The official UGREEN site has now launched an early Black Friday sale with some huge markdowns on various gear including its latest releases in the Uno series, power banks, travel chargers, and much more. While much of this gear is matched at the brand’...

Apple’s originally $1,199 M2 MacBook Air with 16GB of RAM is now down at $799 shipped

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As many of you already know by now, Apple’s has upgraded all current generation Macs to start with 16GB of RAM (finally). However, this also carried back to the now previous-generation M2 MacBook Air models as well. While we are indeed now tracking ext...

Samsung’s Next-Gen HBM4 Memory To Enter Mass Production By End-2025, Tape-Out To Be Achieved Next Quarter

News
Samsung looks to take the lead in the next-gen HBM4 memory markets, as the Korean giant is set to tape out the cutting-edge tech by the end of this year. Samsung's HBM4 Memory Is Expected To Come Head-To-Head With SK hynix's Counterpart; Competition Will Be Fiercer This Time The HBM industry is growing rapidly under the AI hype, with demand skyrocketing to new levels. This has prompted firms like Samsung and SK hynix to evolve their HBM products to cater to the fuel of innovation that is currently at its peak in the markets. Interestingly, we never really had an […]

JEDEC Moving Towards HBM4 Spec Finalization: Up To 32 Gb Densities In 16-Hi TSV Stacks, 6.4 Gbps Speeds

News
JEDEC has unveiled the initial specifications of HBM4 as the highly anticipated memory standard nears completion & ultimately enters mass production. HBM4 Is Set To Bring In Massive Memory Capacities, Up To 32 Gb Densities In 16-Hi Stacks The semiconductor and memory industries are all focused on HBM4, the memory type expected to elevate the performance of associated products to new levels. The HBM adoption rate has soared massively in the past year simply due to the demand from the AI markets for products utilizing the memory type, such as AI accelerators. This has not only fueled firms to upscale […]

Samsung & SK hynix Eye 1c DRAM As The Choice For HBM4 Memory, TSMC Preps HBM4 Base Dies On 12nm & 5nm

News
Development on the next-gen HBM4 memory standard is in full swing as TSMC, Samsung & SK hynix prep the latest DRAM & process nodes. TSMC Brings Forward 12nm & 5nm Nodes For HBM4 Memory Base Dies, Samsung & SK hynix Go 1c DRAM Route Both Samsung and SK hynix are in the race to offer the next-generation HBM4 memory standard. The Korean giants have shown their initial plans for a 2025-2026 debut. Samsung has so far eyed the use of 3D Packaging technologies and up to 16-Hi stacks for an unprecedented increase in the VRAM capacities and memory bandwidth while […]

SK Hynix Partners With TSMC On HBM4 Memory & Next-Gen Packaging Technology Development, Eyes 2026 Release

News
SK hynix has announced its partnership with TSMC for the development of next-gen HBM4 memory and packaging technologies such as CoWoS 2. SK hynix Enters The HBM4 Memory Race: Partners With TSMC For Next-Gen Memory & Packaging Innovations The announcement from SK hynix comes just a day after Samsung announced that it has kicked of its very own HBM4 memory development and eyes release in 2025. In that regard, the company will be ready with HBM4 by 2026 for official volume release and we can expect them to also feature some extravagant speeds with higher memory capacities achieved through using […]

Samsung HBM4 Memory In Development For 2025 Debut: 16-Hi Stacks & 3D Packaging

News
Samsung has announced the development of its next-gen HBM4 memory which will debut in 2025 with some grand specs and features. Samsung's Next-Gen HBM4 Memory To Offer Increased Capacities, Increased Speeds & Should Utilize 3D Packaging Technology In a blog post by the Korean semiconductor manufacturer, Samsung once again reaffirmed that its HBM4 memory is currently in development and should debut in 2025. The company's current HBM portfolio includes the HBM3E "Shinebolt" as the top offering, featuring up to 36 GB capacities using 24 Gb DRAM and up to 9.8 Gbps transfer speeds. The memory technology supports stacks up to […]

JEDEC Relaxes HBM4 Memory Thickness on Request of Major Manufacturers, Enables 16-Hi Stacks Within Existing Bonding Tech

News
JEDEC has reportedly provided relaxation for HBM4 memory participants, potentially allowing a more efficient development for 16-Hi designs. JEDEC Eases HBM4 Thickness Thresholds For Manufacturers Including Samsung, SK Hynix & Micron, Removing The Need For Hybrid Bonding Tech For 16-Hi Stacks HBM4 is the next big thing in the memory segment, with every firm involved in developing the memory type most effectively since it would ultimately set the course for success in the next-gen markets. To aid manufacturers, ZDNet Korea reports that JEDEC has decided to reduce the package thickness of HBM4 to 775 micrometers for both 12-layer and 16-layer […]

SK hynix Confirms HBM4 High-Bandwidth Memory Development Begins In 2024

News
SK hynix has confirmed in a blog post that the development of its next-generation HBM4 high-bandwidth memory commences in 2024. SK hynix To Begin Development of Next-Gen HBM4 High-Bandwidth Memory In 2024, To Power The Next Era of Data Centers & AI So far, we have seen Micron & Samsung list down their next-generation HBM4 memory products while also confirming the development. These two companies have highlighted a launch timeframe of around 2025-2026. Based on the latest confirmation from SK hynix, the company has also unveiled that it plans to commence production of the next generation of high-bandwidth memory in […]

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