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Apple Might Launch Its Own Smart Home Camera As It Focuses On Providing A More Integrated Product Experience For Its Users

Wccftech.com - 0
Apple is increasingly focusing on building its own devices and expanding its ecosystem by taking steps towards a more native experience for users and relying less on third-party accessories. While the Cupertino-based tech giant's HomePod and AppleTV have left quite the mark in the smart home category, it generally relies more on outsourcing cameras and other hardware for smart homes. Now, a new report suggests that the company intends to create a fully integrated experience by developing its own smart home accessories. Gurman hints about Apple working on making smart home products like security cameras for a more integrated experience […]
Deals

Best of Black Friday 2024 – power stations and bundles: Anker SOLIX, Bluetti, EcoFlow, Jackery

9to5Toys.com - 0
We’re continuing our Best of Black Friday posts today with a look at the best current deals on power stations and their respective bundle options. Folks across the country and beyond have been steadily investing more and more in the industry for a vari...
gaming

World Of Warcraft Is Finally Getting Player Homes After 20 Years

Kotaku.com - 0
Blizzard has announced that two decades after its release, World of Warcraft is finally going to let players build a home and live in it. The feature has long been requested by WoW players and now it’s finally coming in the game’s next expansion.Read m...
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ArenaNet To Release ‘Godspawn’ Update for Guild Wars 2: Janthir Wilds on November 19, Featuring New 50-Player Titan Battle and More

Wccftech.com - 0
Guild Wars 2: Janthir Wilds will receive the Godspawn update, adding a new 50-player boss battle, a new 10-player raid, and a legendary spear. Guild Wars 2: Janthir Wilds is getting the first major update "Godspawn" on November 19th, expanding the story with new story chapters The MMORPG Guild Wars 2 by ArenaNet is receiving its first major update for the Janthir Wilds expansion soon. It's the first of three major updates, and it'll land on November 19. The update will add new content to the game for the players. The Janthir Wilds expansion DLC was released in August this year, […]

Score a 2TB 7,400MB/s Nextorage heatsink SSD compatible with PS5 at $110 low

Classic RTS Games Warcraft and Warcraft 2 Fully Remastered And Out Now

Native Union Classic Apple Watch Strap with soft nubuck leather lining now $20 (Reg. up to $60)

Amazon has ENGWE’s E26 dual suspension all-terrain e-bike hitting a new $849 low (Reg. $1,399)

Hello! Score 50% off Sam’s Club memberships just in time for the holidays at $25 (Reg. $50)

Dragon Age: The Veilguard’s Hardest Choice Has Fans Scouring For A Way Out

Spigen’s Titanium Keychain Multi-tool with knife, bottle opener, and carabiner now $34 (50% off)

NVIDIA’s DLSS 3.8.10 Package Reduces Preset Modes To Just Two Profiles, Drastically Reducing DLL File Size

Xbox Boss Says No ‘Red Line’ With Exclusives, Including Even Halo

PlayStation Store and Xbox gift cards now on sale from $9 ahead of upcoming Black Friday sales

Apple Will Launch A New ‘Command Center’ Home Device In March With Apple Intelligence Integration, As It Steps Into The Home Industry

Heybike’s Cityrun commuter e-bike carries you up to 55 miles of travel on a four-hour charge at $999 low (Save $600), more

Get two fully adjustable foldable smartphone holders on rotating metal bases at just $8 Prime shipped ($4 ea.)

What did the snowball Earth look like?

PlayStation Plus Brings Back Grand Theft Auto V And A Bunch Of Other Big Games

How Valve made Half-Life 2 and set a new standard for future games

Apple’s MetalFX Upscaling Comparison At 1080p Running Resident Evil 4 Remake Shows Reduced Image Quality, But Framerate Gets Up To 44 Percent Performance Bump

Here’s Our Favorite Cosplay From Dragon Con 2024

Nordstrom’s Early Black Friday Sale is live! Save up to 60% off Nike, Cole Haan, On Cloud, more

Latest Bose Ultra Open earbuds with spatialized audio return to $249 Amazon low

News

Samsung’s Next-Gen HBM4 Memory To Enter Mass Production By End-2025, Tape-Out To Be Achieved Next Quarter

Wccftech.com - 0
Samsung looks to take the lead in the next-gen HBM4 memory markets, as the Korean giant is set to tape out the cutting-edge tech by the end of this year. Samsung's HBM4 Memory Is Expected To Come Head-To-Head With SK hynix's Counterpart; Competition Will Be Fiercer This Time The HBM industry is growing rapidly under the AI hype, with demand skyrocketing to new levels. This has prompted firms like Samsung and SK hynix to evolve their HBM products to cater to the fuel of innovation that is currently at its peak in the markets. Interestingly, we never really had an […]
Read more
News

JEDEC Moving Towards HBM4 Spec Finalization: Up To 32 Gb Densities In 16-Hi TSV Stacks, 6.4 Gbps Speeds

Wccftech.com - 0
JEDEC has unveiled the initial specifications of HBM4 as the highly anticipated memory standard nears completion & ultimately enters mass production. HBM4 Is Set To Bring In Massive Memory Capacities, Up To 32 Gb Densities In 16-Hi Stacks The semiconductor and memory industries are all focused on HBM4, the memory type expected to elevate the performance of associated products to new levels. The HBM adoption rate has soared massively in the past year simply due to the demand from the AI markets for products utilizing the memory type, such as AI accelerators. This has not only fueled firms to upscale […]
Read more
News

Samsung & SK hynix Eye 1c DRAM As The Choice For HBM4 Memory, TSMC Preps HBM4 Base Dies On 12nm & 5nm

Wccftech.com - 0
Development on the next-gen HBM4 memory standard is in full swing as TSMC, Samsung & SK hynix prep the latest DRAM & process nodes. TSMC Brings Forward 12nm & 5nm Nodes For HBM4 Memory Base Dies, Samsung & SK hynix Go 1c DRAM Route Both Samsung and SK hynix are in the race to offer the next-generation HBM4 memory standard. The Korean giants have shown their initial plans for a 2025-2026 debut. Samsung has so far eyed the use of 3D Packaging technologies and up to 16-Hi stacks for an unprecedented increase in the VRAM capacities and memory bandwidth while […]
Read more
News

SK Hynix Partners With TSMC On HBM4 Memory & Next-Gen Packaging Technology Development, Eyes 2026 Release

Wccftech.com - 0
SK hynix has announced its partnership with TSMC for the development of next-gen HBM4 memory and packaging technologies such as CoWoS 2. SK hynix Enters The HBM4 Memory Race: Partners With TSMC For Next-Gen Memory & Packaging Innovations The announcement from SK hynix comes just a day after Samsung announced that it has kicked of its very own HBM4 memory development and eyes release in 2025. In that regard, the company will be ready with HBM4 by 2026 for official volume release and we can expect them to also feature some extravagant speeds with higher memory capacities achieved through using […]
Read more
News

Samsung HBM4 Memory In Development For 2025 Debut: 16-Hi Stacks & 3D Packaging

Wccftech.com - 0
Samsung has announced the development of its next-gen HBM4 memory which will debut in 2025 with some grand specs and features. Samsung's Next-Gen HBM4 Memory To Offer Increased Capacities, Increased Speeds & Should Utilize 3D Packaging Technology In a blog post by the Korean semiconductor manufacturer, Samsung once again reaffirmed that its HBM4 memory is currently in development and should debut in 2025. The company's current HBM portfolio includes the HBM3E "Shinebolt" as the top offering, featuring up to 36 GB capacities using 24 Gb DRAM and up to 9.8 Gbps transfer speeds. The memory technology supports stacks up to […]
Read more
News

JEDEC Relaxes HBM4 Memory Thickness on Request of Major Manufacturers, Enables 16-Hi Stacks Within Existing Bonding Tech

Wccftech.com - 0
JEDEC has reportedly provided relaxation for HBM4 memory participants, potentially allowing a more efficient development for 16-Hi designs. JEDEC Eases HBM4 Thickness Thresholds For Manufacturers Including Samsung, SK Hynix & Micron, Removing The Need For Hybrid Bonding Tech For 16-Hi Stacks HBM4 is the next big thing in the memory segment, with every firm involved in developing the memory type most effectively since it would ultimately set the course for success in the next-gen markets. To aid manufacturers, ZDNet Korea reports that JEDEC has decided to reduce the package thickness of HBM4 to 775 micrometers for both 12-layer and 16-layer […]
Read more
News

SK hynix Confirms HBM4 High-Bandwidth Memory Development Begins In 2024

Wccftech.com - 0
SK hynix has confirmed in a blog post that the development of its next-generation HBM4 high-bandwidth memory commences in 2024. SK hynix To Begin Development of Next-Gen HBM4 High-Bandwidth Memory In 2024, To Power The Next Era of Data Centers & AI So far, we have seen Micron & Samsung list down their next-generation HBM4 memory products while also confirming the development. These two companies have highlighted a launch timeframe of around 2025-2026. Based on the latest confirmation from SK hynix, the company has also unveiled that it plans to commence production of the next generation of high-bandwidth memory in […]
Read more

Tag: HBM4 Memory

How To Unlock Every Hero And Weapon Evolution In Vampire Survivors Ode To Castlevania DLC

gaming
Vampire Survivors draws tons of inspiration from Castlevania, so it is no surprise that the new Ode To Castlevania DLC is fantastic. I’m here to guide you through unlocking each Hero and evolving each weapon, because that’s how you’ll end up accessing ...

Overwatch Players, Y’all Lived Like This In 2016?

gaming
I started playing Overwatch in 2019. By the time I was pushing payloads and getting Play of the Game with a well-placed Tactical Visor, a lot of the old hero kits and team compositions that were infamous when the hero shooter launched in 2016 were more...

Samsung’s Next-Gen HBM4 Memory To Enter Mass Production By End-2025, Tape-Out To Be Achieved Next Quarter

News
Samsung looks to take the lead in the next-gen HBM4 memory markets, as the Korean giant is set to tape out the cutting-edge tech by the end of this year. Samsung's HBM4 Memory Is Expected To Come Head-To-Head With SK hynix's Counterpart; Competition Will Be Fiercer This Time The HBM industry is growing rapidly under the AI hype, with demand skyrocketing to new levels. This has prompted firms like Samsung and SK hynix to evolve their HBM products to cater to the fuel of innovation that is currently at its peak in the markets. Interestingly, we never really had an […]

JEDEC Moving Towards HBM4 Spec Finalization: Up To 32 Gb Densities In 16-Hi TSV Stacks, 6.4 Gbps Speeds

News
JEDEC has unveiled the initial specifications of HBM4 as the highly anticipated memory standard nears completion & ultimately enters mass production. HBM4 Is Set To Bring In Massive Memory Capacities, Up To 32 Gb Densities In 16-Hi Stacks The semiconductor and memory industries are all focused on HBM4, the memory type expected to elevate the performance of associated products to new levels. The HBM adoption rate has soared massively in the past year simply due to the demand from the AI markets for products utilizing the memory type, such as AI accelerators. This has not only fueled firms to upscale […]

Samsung & SK hynix Eye 1c DRAM As The Choice For HBM4 Memory, TSMC Preps HBM4 Base Dies On 12nm & 5nm

News
Development on the next-gen HBM4 memory standard is in full swing as TSMC, Samsung & SK hynix prep the latest DRAM & process nodes. TSMC Brings Forward 12nm & 5nm Nodes For HBM4 Memory Base Dies, Samsung & SK hynix Go 1c DRAM Route Both Samsung and SK hynix are in the race to offer the next-generation HBM4 memory standard. The Korean giants have shown their initial plans for a 2025-2026 debut. Samsung has so far eyed the use of 3D Packaging technologies and up to 16-Hi stacks for an unprecedented increase in the VRAM capacities and memory bandwidth while […]

SK Hynix Partners With TSMC On HBM4 Memory & Next-Gen Packaging Technology Development, Eyes 2026 Release

News
SK hynix has announced its partnership with TSMC for the development of next-gen HBM4 memory and packaging technologies such as CoWoS 2. SK hynix Enters The HBM4 Memory Race: Partners With TSMC For Next-Gen Memory & Packaging Innovations The announcement from SK hynix comes just a day after Samsung announced that it has kicked of its very own HBM4 memory development and eyes release in 2025. In that regard, the company will be ready with HBM4 by 2026 for official volume release and we can expect them to also feature some extravagant speeds with higher memory capacities achieved through using […]

Samsung HBM4 Memory In Development For 2025 Debut: 16-Hi Stacks & 3D Packaging

News
Samsung has announced the development of its next-gen HBM4 memory which will debut in 2025 with some grand specs and features. Samsung's Next-Gen HBM4 Memory To Offer Increased Capacities, Increased Speeds & Should Utilize 3D Packaging Technology In a blog post by the Korean semiconductor manufacturer, Samsung once again reaffirmed that its HBM4 memory is currently in development and should debut in 2025. The company's current HBM portfolio includes the HBM3E "Shinebolt" as the top offering, featuring up to 36 GB capacities using 24 Gb DRAM and up to 9.8 Gbps transfer speeds. The memory technology supports stacks up to […]

JEDEC Relaxes HBM4 Memory Thickness on Request of Major Manufacturers, Enables 16-Hi Stacks Within Existing Bonding Tech

News
JEDEC has reportedly provided relaxation for HBM4 memory participants, potentially allowing a more efficient development for 16-Hi designs. JEDEC Eases HBM4 Thickness Thresholds For Manufacturers Including Samsung, SK Hynix & Micron, Removing The Need For Hybrid Bonding Tech For 16-Hi Stacks HBM4 is the next big thing in the memory segment, with every firm involved in developing the memory type most effectively since it would ultimately set the course for success in the next-gen markets. To aid manufacturers, ZDNet Korea reports that JEDEC has decided to reduce the package thickness of HBM4 to 775 micrometers for both 12-layer and 16-layer […]

SK hynix Confirms HBM4 High-Bandwidth Memory Development Begins In 2024

News
SK hynix has confirmed in a blog post that the development of its next-generation HBM4 high-bandwidth memory commences in 2024. SK hynix To Begin Development of Next-Gen HBM4 High-Bandwidth Memory In 2024, To Power The Next Era of Data Centers & AI So far, we have seen Micron & Samsung list down their next-generation HBM4 memory products while also confirming the development. These two companies have highlighted a launch timeframe of around 2025-2026. Based on the latest confirmation from SK hynix, the company has also unveiled that it plans to commence production of the next generation of high-bandwidth memory in […]

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