[tds_menu_login inline="yes" guest_tdicon="td-icon-profile" logout_tdicon="td-icon-log-out" tdc_css="eyJwaG9uZSI6eyJtYXJnaW4tcmlnaHQiOiIyMCIsIm1hcmdpbi1ib3R0b20iOiIwIiwibWFyZ2luLWxlZnQiOiI2IiwiZGlzcGxheSI6IiJ9LCJwaG9uZV9tYXhfd2lkdGgiOjc2N30=" toggle_hide="eyJwaG9uZSI6InllcyJ9" ia_space="eyJwaG9uZSI6IjAifQ==" icon_size="eyJhbGwiOjI0LCJwaG9uZSI6IjIwIn0=" avatar_size="eyJwaG9uZSI6IjIwIn0=" show_menu="yes" menu_offset_top="eyJwaG9uZSI6IjE4In0=" menu_offset_horiz="eyJhbGwiOjgsInBob25lIjoiLTMifQ==" menu_width="eyJwaG9uZSI6IjE4MCJ9" menu_horiz_align="eyJhbGwiOiJjb250ZW50LWhvcml6LWxlZnQiLCJwaG9uZSI6ImNvbnRlbnQtaG9yaXotcmlnaHQifQ==" menu_uh_padd="eyJwaG9uZSI6IjEwcHggMTVweCA4cHgifQ==" menu_gh_padd="eyJwaG9uZSI6IjEwcHggMTVweCA4cHgifQ==" menu_ul_padd="eyJwaG9uZSI6IjhweCAxNXB4In0=" menu_ul_space="eyJwaG9uZSI6IjYifQ==" menu_ulo_padd="eyJwaG9uZSI6IjhweCAxNXB4IDEwcHgifQ==" menu_gc_padd="eyJwaG9uZSI6IjhweCAxNXB4IDEwcHgifQ==" menu_bg="var(--news-hub-black)" menu_shadow_shadow_size="eyJwaG9uZSI6IjAifQ==" menu_arrow_color="rgba(0,0,0,0)" menu_uh_color="var(--news-hub-light-grey)" menu_uh_border_color="var(--news-hub-dark-grey)" menu_ul_link_color="var(--news-hub-white)" menu_ul_link_color_h="var(--news-hub-accent-hover)" menu_ul_sep_color="var(--news-hub-dark-grey)" menu_uf_txt_color="var(--news-hub-white)" menu_uf_txt_color_h="var(--news-hub-accent-hover)" menu_uf_border_color="var(--news-hub-dark-grey)" f_uh_font_size="eyJwaG9uZSI6IjEyIn0=" f_uh_font_line_height="eyJwaG9uZSI6IjEuMyJ9" f_uh_font_family="eyJwaG9uZSI6IjMyNSJ9" f_links_font_size="eyJwaG9uZSI6IjEyIn0=" f_links_font_line_height="eyJwaG9uZSI6IjEuMyJ9" f_links_font_family="eyJwaG9uZSI6IjMyNSJ9" f_uf_font_size="eyJwaG9uZSI6IjEyIn0=" f_uf_font_line_height="eyJwaG9uZSI6IjEuMyJ9" f_uf_font_family="eyJwaG9uZSI6IjMyNSJ9" f_gh_font_family="eyJwaG9uZSI6IjMyNSJ9" f_gh_font_size="eyJwaG9uZSI6IjEyIn0=" f_gh_font_line_height="eyJwaG9uZSI6IjEuMyJ9" f_btn1_font_family="eyJwaG9uZSI6IjMyNSJ9" f_btn1_font_weight="eyJwaG9uZSI6IjcwMCJ9" f_btn1_font_transform="eyJwaG9uZSI6InVwcGVyY2FzZSJ9" f_btn2_font_weight="eyJwaG9uZSI6IjcwMCJ9" f_btn2_font_transform="eyJwaG9uZSI6InVwcGVyY2FzZSJ9" f_btn2_font_family="eyJwaG9uZSI6IjMyNSJ9"]
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[tds_menu_login guest_tdicon="td-icon-profile" logout_tdicon="td-icon-log-out" tdc_css="eyJhbGwiOnsibWFyZ2luLWJvdHRvbSI6IjAiLCJkaXNwbGF5IjoiIn19" toggle_txt_color="var(--news-hub-white)" menu_offset_top="eyJhbGwiOiIxOSIsImxhbmRzY2FwZSI6IjE3IiwicG9ydHJhaXQiOiIxNSJ9" menu_offset_horiz="eyJhbGwiOi02LCJsYW5kc2NhcGUiOiItMyIsInBvcnRyYWl0IjoiLTIifQ==" menu_horiz_align="content-horiz-right" menu_bg="var(--news-hub-black)" menu_uh_color="var(--news-hub-light-grey)" menu_uh_border_color="var(--news-hub-dark-grey)" menu_ul_link_color="#ffffff" menu_ul_link_color_h="var(--news-hub-accent-hover)" menu_ul_sep_color="var(--news-hub-dark-grey)" menu_uf_txt_color="var(--news-hub-white)" menu_uf_txt_color_h="var(--news-hub-accent-hover)" menu_uf_border_color="var(--news-hub-dark-grey)" f_uh_font_family="325" f_uh_font_line_height="1.3" f_links_font_family="325" f_links_font_line_height="1.3" f_uf_font_line_height="1.3" f_uf_font_family="325" menu_uh_padd="eyJhbGwiOiIyMHB4IDI1cHggMThweCIsImxhbmRzY2FwZSI6IjE1cHggMjBweCAxM3B4IiwicG9ydHJhaXQiOiIxMHB4IDE1cHggOHB4In0=" menu_ul_padd="eyJhbGwiOiIxOHB4IDI1cHgiLCJsYW5kc2NhcGUiOiIxNnB4IDIwcHgiLCJwb3J0cmFpdCI6IjhweCAxNXB4In0=" menu_ul_space="eyJhbGwiOiIxMCIsImxhbmRzY2FwZSI6IjgiLCJwb3J0cmFpdCI6IjYifQ==" menu_ulo_padd="eyJhbGwiOiIxOHB4IDI1cHggMjBweCIsImxhbmRzY2FwZSI6IjEzcHggMjBweCAxNXB4IiwicG9ydHJhaXQiOiI4cHggMTVweCAxMHB4In0=" menu_shadow_shadow_size="0" menu_arrow_color="rgba(255,255,255,0)" menu_width="eyJhbGwiOiIyMjAiLCJwb3J0cmFpdCI6IjE4MCJ9" show_version="" menu_gh_padd="eyJhbGwiOiIyMHB4IDI1cHggMThweCIsImxhbmRzY2FwZSI6IjE1cHggMjBweCAxM3B4IiwicG9ydHJhaXQiOiIxMHB4IDE1cHggOHB4In0=" menu_gc_padd="eyJhbGwiOiIxOHB4IDI1cHggMjBweCIsImxhbmRzY2FwZSI6IjEzcHggMjBweCAxNXB4IiwicG9ydHJhaXQiOiI4cHggMTVweCAxMHB4In0=" menu_gh_color="var(--news-hub-light-grey)" menu_gh_border_color="var(--news-hub-dark-grey)" f_gh_font_family="325" menu_gc_btn1_bg_color="var(--news-hub-accent)" menu_gc_btn1_bg_color_h="var(--news-hub-accent-hover)" menu_gc_btn2_color="var(--news-hub-accent)" menu_gc_btn2_color_h="var(--news-hub-accent-hover)" f_btn1_font_family="325" f_btn1_font_transform="uppercase" f_btn2_font_family="325" f_btn2_font_transform="uppercase" f_btn1_font_weight="700" f_btn2_font_weight="700" show_menu="yes" f_uf_font_size="eyJsYW5kc2NhcGUiOiIxMiIsInBvcnRyYWl0IjoiMTIifQ==" icon_color="var(--news-hub-white)" icon_size="eyJhbGwiOjIyLCJsYW5kc2NhcGUiOiIyMCIsInBvcnRyYWl0IjoiMTgifQ==" avatar_size="eyJhbGwiOiIyMiIsImxhbmRzY2FwZSI6IjIwIiwicG9ydHJhaXQiOiIxOCJ9" ia_space="eyJhbGwiOiIxMCIsImxhbmRzY2FwZSI6IjgiLCJwb3J0cmFpdCI6IjYifQ==" f_toggle_font_family="325" f_toggle_font_size="eyJhbGwiOiIxNCIsImxhbmRzY2FwZSI6IjEzIiwicG9ydHJhaXQiOiIxMiJ9" logout_size="eyJhbGwiOjE0LCJsYW5kc2NhcGUiOiIxMyJ9" f_uh_font_size="eyJsYW5kc2NhcGUiOiIxMyIsInBvcnRyYWl0IjoiMTIifQ==" f_links_font_size="eyJsYW5kc2NhcGUiOiIxMyIsInBvcnRyYWl0IjoiMTIifQ==" f_gh_font_size="eyJsYW5kc2NhcGUiOiIxMyIsInBvcnRyYWl0IjoiMTIifQ=="]
gaming

Grab 2024’s Most Ridiculous RPG While It’s On Sale

Kotaku.com - 0
At the beginning of the year, Like a Dragon: Infinite Wealth launched a hell of an opening salvo. The latest installment in the long-running Like a Dragon/Yakuza series is comically full of things to do. On one hand, it’s a turn-based RPG epic, splitti...
News

Jeff Grubb Says Next State of Play Likely To Announce A “Less Exciting” Remaster

Wccftech.com - 0
It's seemingly confirmed that Horizon Zero Dawn is getting a remaster, despite the fact it really doesn't need one. Sony is focusing on making the games look a bit cleaner and visually striking instead of rebooting or porting franchises that people actually care about. Although it hasn't been officially confirmed that a Horizon Zero Dawn remaster is coming, it's quite likely since the rumor has been floating around since 2022. People now believe this is happening because the supposed remastered version has been rated by the ESRB, listening to PC and PlayStation 5 as the platforms. In the latest Game […]
gaming

The Final Joker 2 Trailer Is Here

Kotaku.com - 0
Joker 2, technically titled Joker: Folie à Deux, is just a couple of weeks away, and the final trailer has arrived to try and seal the deal for potential audience goers who are still on the fence about whether a “jukebox” musical is how they want to se...
News

Apple’s A18 Pro Is 13 Percent Faster Than A17 Pro In GFXBench’s Aztec Ruins Benchmark; New Milestone Is Achieved At A Worse ‘Performance Per...

Wccftech.com - 0
The A18 Pro powering the iPhone 16 Pro and iPhone 16 Pro Max had already cemented its position as Apple’s fastest smartphone silicon to date by being 18 percent faster than last year’s A17 Pro in Geekbench 6’s Metal benchmark while also trading blows with the M1 in the single-core and multi-core department. In the latest GFXBench Aztec Ruins test, the newest SoC once again reaches a new performance plateau, but a closer look at the comparison reveals that it had to operate at a higher power draw to achieve this difference, resulting in a worse ‘performance per watt’ ratio. In the […]

New Simpsons Halloween Short Will Team Up Sideshow Bob With Disney Villains

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Get budget-friendly reliability with Greenworks’ 40V 14-inch cordless electric push mower at new $187 low (Reg. $270)

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News

JEDEC Moving Towards HBM4 Spec Finalization: Up To 32 Gb Densities In 16-Hi TSV Stacks, 6.4 Gbps Speeds

Wccftech.com - 0
JEDEC has unveiled the initial specifications of HBM4 as the highly anticipated memory standard nears completion & ultimately enters mass production. HBM4 Is Set To Bring In Massive Memory Capacities, Up To 32 Gb Densities In 16-Hi Stacks The semiconductor and memory industries are all focused on HBM4, the memory type expected to elevate the performance of associated products to new levels. The HBM adoption rate has soared massively in the past year simply due to the demand from the AI markets for products utilizing the memory type, such as AI accelerators. This has not only fueled firms to upscale […]
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News

Samsung & SK hynix Eye 1c DRAM As The Choice For HBM4 Memory, TSMC Preps HBM4 Base Dies On 12nm & 5nm

Wccftech.com - 0
Development on the next-gen HBM4 memory standard is in full swing as TSMC, Samsung & SK hynix prep the latest DRAM & process nodes. TSMC Brings Forward 12nm & 5nm Nodes For HBM4 Memory Base Dies, Samsung & SK hynix Go 1c DRAM Route Both Samsung and SK hynix are in the race to offer the next-generation HBM4 memory standard. The Korean giants have shown their initial plans for a 2025-2026 debut. Samsung has so far eyed the use of 3D Packaging technologies and up to 16-Hi stacks for an unprecedented increase in the VRAM capacities and memory bandwidth while […]
Read more
News

SK Hynix Partners With TSMC On HBM4 Memory & Next-Gen Packaging Technology Development, Eyes 2026 Release

Wccftech.com - 0
SK hynix has announced its partnership with TSMC for the development of next-gen HBM4 memory and packaging technologies such as CoWoS 2. SK hynix Enters The HBM4 Memory Race: Partners With TSMC For Next-Gen Memory & Packaging Innovations The announcement from SK hynix comes just a day after Samsung announced that it has kicked of its very own HBM4 memory development and eyes release in 2025. In that regard, the company will be ready with HBM4 by 2026 for official volume release and we can expect them to also feature some extravagant speeds with higher memory capacities achieved through using […]
Read more
News

Samsung HBM4 Memory In Development For 2025 Debut: 16-Hi Stacks & 3D Packaging

Wccftech.com - 0
Samsung has announced the development of its next-gen HBM4 memory which will debut in 2025 with some grand specs and features. Samsung's Next-Gen HBM4 Memory To Offer Increased Capacities, Increased Speeds & Should Utilize 3D Packaging Technology In a blog post by the Korean semiconductor manufacturer, Samsung once again reaffirmed that its HBM4 memory is currently in development and should debut in 2025. The company's current HBM portfolio includes the HBM3E "Shinebolt" as the top offering, featuring up to 36 GB capacities using 24 Gb DRAM and up to 9.8 Gbps transfer speeds. The memory technology supports stacks up to […]
Read more
News

JEDEC Relaxes HBM4 Memory Thickness on Request of Major Manufacturers, Enables 16-Hi Stacks Within Existing Bonding Tech

Wccftech.com - 0
JEDEC has reportedly provided relaxation for HBM4 memory participants, potentially allowing a more efficient development for 16-Hi designs. JEDEC Eases HBM4 Thickness Thresholds For Manufacturers Including Samsung, SK Hynix & Micron, Removing The Need For Hybrid Bonding Tech For 16-Hi Stacks HBM4 is the next big thing in the memory segment, with every firm involved in developing the memory type most effectively since it would ultimately set the course for success in the next-gen markets. To aid manufacturers, ZDNet Korea reports that JEDEC has decided to reduce the package thickness of HBM4 to 775 micrometers for both 12-layer and 16-layer […]
Read more
News

SK hynix Confirms HBM4 High-Bandwidth Memory Development Begins In 2024

Wccftech.com - 0
SK hynix has confirmed in a blog post that the development of its next-generation HBM4 high-bandwidth memory commences in 2024. SK hynix To Begin Development of Next-Gen HBM4 High-Bandwidth Memory In 2024, To Power The Next Era of Data Centers & AI So far, we have seen Micron & Samsung list down their next-generation HBM4 memory products while also confirming the development. These two companies have highlighted a launch timeframe of around 2025-2026. Based on the latest confirmation from SK hynix, the company has also unveiled that it plans to commence production of the next generation of high-bandwidth memory in […]
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Tag: HBM4 Memory

Nintendo Is Officially Suing PocketPair, Creators of Palworld

News
Nintendo has officially announced that it is suing PocketPair, the creators of Palworld, in collaboration with The Pokemon Company. In a statement on NintendoCoLtd on X, Nintendo filed a patent infringement lawsuit in the Tokyo District Court on September 18, 2024. This lawsuit aims to seek an injunction against infringement and damages after PocketPair allegedly infringed multiple patents in Palworld. This news isn't surprising, except that it didn't come sooner. Palworld was first released in January 2024. In the game, there are plenty of "Pals" that look incredibly similar to the creatures in Pokemon, to the point that it's bordering […]

Grab One Of Shadow Of The Erdtree’s Best Shields, Guarded By A Ghost

gaming
The Serpent Crest Shield is a Medium Shield added in Elden Ring’s Shadow of the Erdtree expansion. It’s an excellent choice for those seeking full physical blocking abilities without being weighed down by one of the game’s massive Greatshields. We high...

JEDEC Moving Towards HBM4 Spec Finalization: Up To 32 Gb Densities In 16-Hi TSV Stacks, 6.4 Gbps Speeds

News
JEDEC has unveiled the initial specifications of HBM4 as the highly anticipated memory standard nears completion & ultimately enters mass production. HBM4 Is Set To Bring In Massive Memory Capacities, Up To 32 Gb Densities In 16-Hi Stacks The semiconductor and memory industries are all focused on HBM4, the memory type expected to elevate the performance of associated products to new levels. The HBM adoption rate has soared massively in the past year simply due to the demand from the AI markets for products utilizing the memory type, such as AI accelerators. This has not only fueled firms to upscale […]

Samsung & SK hynix Eye 1c DRAM As The Choice For HBM4 Memory, TSMC Preps HBM4 Base Dies On 12nm & 5nm

News
Development on the next-gen HBM4 memory standard is in full swing as TSMC, Samsung & SK hynix prep the latest DRAM & process nodes. TSMC Brings Forward 12nm & 5nm Nodes For HBM4 Memory Base Dies, Samsung & SK hynix Go 1c DRAM Route Both Samsung and SK hynix are in the race to offer the next-generation HBM4 memory standard. The Korean giants have shown their initial plans for a 2025-2026 debut. Samsung has so far eyed the use of 3D Packaging technologies and up to 16-Hi stacks for an unprecedented increase in the VRAM capacities and memory bandwidth while […]

SK Hynix Partners With TSMC On HBM4 Memory & Next-Gen Packaging Technology Development, Eyes 2026 Release

News
SK hynix has announced its partnership with TSMC for the development of next-gen HBM4 memory and packaging technologies such as CoWoS 2. SK hynix Enters The HBM4 Memory Race: Partners With TSMC For Next-Gen Memory & Packaging Innovations The announcement from SK hynix comes just a day after Samsung announced that it has kicked of its very own HBM4 memory development and eyes release in 2025. In that regard, the company will be ready with HBM4 by 2026 for official volume release and we can expect them to also feature some extravagant speeds with higher memory capacities achieved through using […]

Samsung HBM4 Memory In Development For 2025 Debut: 16-Hi Stacks & 3D Packaging

News
Samsung has announced the development of its next-gen HBM4 memory which will debut in 2025 with some grand specs and features. Samsung's Next-Gen HBM4 Memory To Offer Increased Capacities, Increased Speeds & Should Utilize 3D Packaging Technology In a blog post by the Korean semiconductor manufacturer, Samsung once again reaffirmed that its HBM4 memory is currently in development and should debut in 2025. The company's current HBM portfolio includes the HBM3E "Shinebolt" as the top offering, featuring up to 36 GB capacities using 24 Gb DRAM and up to 9.8 Gbps transfer speeds. The memory technology supports stacks up to […]

JEDEC Relaxes HBM4 Memory Thickness on Request of Major Manufacturers, Enables 16-Hi Stacks Within Existing Bonding Tech

News
JEDEC has reportedly provided relaxation for HBM4 memory participants, potentially allowing a more efficient development for 16-Hi designs. JEDEC Eases HBM4 Thickness Thresholds For Manufacturers Including Samsung, SK Hynix & Micron, Removing The Need For Hybrid Bonding Tech For 16-Hi Stacks HBM4 is the next big thing in the memory segment, with every firm involved in developing the memory type most effectively since it would ultimately set the course for success in the next-gen markets. To aid manufacturers, ZDNet Korea reports that JEDEC has decided to reduce the package thickness of HBM4 to 775 micrometers for both 12-layer and 16-layer […]

SK hynix Confirms HBM4 High-Bandwidth Memory Development Begins In 2024

News
SK hynix has confirmed in a blog post that the development of its next-generation HBM4 high-bandwidth memory commences in 2024. SK hynix To Begin Development of Next-Gen HBM4 High-Bandwidth Memory In 2024, To Power The Next Era of Data Centers & AI So far, we have seen Micron & Samsung list down their next-generation HBM4 memory products while also confirming the development. These two companies have highlighted a launch timeframe of around 2025-2026. Based on the latest confirmation from SK hynix, the company has also unveiled that it plans to commence production of the next generation of high-bandwidth memory in […]

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