Coming at us once more by way of its official Amazon storefront, Roborock is giving us another shot at Prime Day pricing with its Q7 Max+ Robot Vacuum and Mop with Auto-Empty Dock for $379.98 shipped. Down from its usual $870 price tag, this is the bes...
Courtesy of its official Amazon storefront, Govee is offering its RGBIC Gaming Light Bars with smart controller for $59.99 shipped. Normally priced at $90, we’ve been seeing more frequent drops to this same rate in 2024, often dropping once every one t...
Samsung is readying its own chip packaging solution to rival TSMC's CoWoS which is reportedly going to be called SAINT. Samsung SAINT & TSMC CoWoS Technologies Are Going To Compete To Secure Orders For Advanced Chip Packaging From Major Chipmakers Including NVIDIA & AMD The latest report comes from The Korean Economic Daily which is reporting that the Korean tech giant, Samsung, is readying its own advanced packaging solution to compete against the widely popular CoWoS (Chip-on-Wafer-on-Substrate) packaging technology from TSMC. It is reported that Samsung plans to unveil its solution next year and will be calling it SAINT or […]
A series of custom connectivity chips will be introduced to various Apple products in 2025, making it the first time that the technology giant will dive into mass producing Wi-Fi and 5G silicon for its devices. A new report states that next year, the Cupertino giant could reduce dependency on companies like Broadcom by unveiling its in-house solution, but there is still a possibility of some delay happening. There is a minute possibility that the Wi-Fi chips will arrive for the new iPad models in 2026 when the iPhone 18 series launches A report from DigiTimes that was spotted by […]
A series of custom connectivity chips will be introduced to various Apple products in 2025, making it the first time that the technology giant will dive into mass producing Wi-Fi and 5G silicon for its devices. A new report states that next year, the Cupertino giant could reduce dependency on companies like Broadcom by unveiling its in-house solution, but there is still a possibility of some delay happening. There is a minute possibility that the Wi-Fi chips will arrive for the new iPad models in 2026 when the iPhone 18 series launches A report from DigiTimes that was spotted by […]
Samsung is readying its own chip packaging solution to rival TSMC's CoWoS which is reportedly going to be called SAINT. Samsung SAINT & TSMC CoWoS Technologies Are Going To Compete To Secure Orders For Advanced Chip Packaging From Major Chipmakers Including NVIDIA & AMD The latest report comes from The Korean Economic Daily which is reporting that the Korean tech giant, Samsung, is readying its own advanced packaging solution to compete against the widely popular CoWoS (Chip-on-Wafer-on-Substrate) packaging technology from TSMC. It is reported that Samsung plans to unveil its solution next year and will be calling it SAINT or […]