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Two PlayStation 6 SoCs Are in the Works; One of Them Will Probably Be Affordable – Rumor

Wccftech.com - 0
Two different PlayStation 6 SoCs are said to be in the works, suggesting that the next-generation Sony system will be released in two different SKUs. Speaking on the NeoGAF forums, well-known AMD leaker Kepler revealed there are two SoCs in development for the next-gen system, but the insider cannot confirm if it's an Xbox Series X and Xbox Series S situation or a home console and a handheld. One of the two, the insider added, should be affordable at least, suggesting there's a clear power difference between the two. Very little is known about the PlayStation 6. Earlier this week, […]
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Fitbit users struggle with “very frustrating” app bugs for months

ArsTechnica.com - 0
People have been complaining about some of the issues since at least April.
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Life imitates xkcd comic as Florida gang beats crypto password from retiree

ArsTechnica.com - 0
Group staged home invasions to steal cryptocurrency.
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Second chance at scoring the Greenworks Pro-tier 3,000 PSI electric pressure washer at its $290 low (Reg. $450)

9to5Toys.com - 0
After first spotting this deal a few days ago in a one-day-only sale, Amazon is offering a more long-term discount on the Greenworks Pro 3000 PSI Electric Pressure Washer for $289.99 shipped. It’s normally listed at $450 most days, with Best Buy often ...

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News

TSMC Wants To Scale Up Chips Using Bigger Packages As Part of Its System-on-Wafer “SoW” Technology

Wccftech.com - 0
Well, forget chip shrinking and focus on interposer advancements. TSMC has implemented this by unveiling enormous plans for the next generation of SoW packaging. TSMC Sees Next-Gen "SoW" Chip Packaging As a Crucial Factor To Progress Into the Future, Making Chips Bigger Than Ever! Before diving into what TSMC has disclosed, let's talk about interposers. Imagine a chip in your hand. Well, it's a powerful one if you assume it. Now, if you are eager to harness more capabilities out of a single chip, instead of going the innovation route, the industry slaps multiple chips and connects them against each […]
Read more
News

TSMC To Invest $16 Billion Into Six New CoWoS Facilities In Taiwan As It Anticipates Huge AI Demand

Wccftech.com - 0
TSMC is set to significantly upscale its CoWoS packaging output, as the Taiwan giant plans to spend almost US $16 billion on building new facilities. TSMC Looks To Rapidly Expand Its CoWoS Output Through Massive Investments, Ensuring a Seamless Supply Chain For AI Customers CoWoS packaging has seen a tremendous rise in demand in the past year, as resources play a vital role in manufacturing AI accelerators, which are the "holy grail" of the AI industry. As we transition into the next-gen era, AI GPU suppliers wouldn't certainly want to experience a supply chain bottleneck, which was previously caused by […]
Read more
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TSMC to Double CoWoS Production By This Year, Attracting Huge Client Interest

Wccftech.com - 0
TSMC is reportedly giving its all regarding the highly demanding CoWoS supply, as the Taiwanese giant plans to double down on production this year. TSMC Doubling CoWoS Production As AI Bandwagon Is Expected To Ride Its Way Into 2024, Expanding The Supply & Demand Chain To New Levels CoWoS packaging is considered a vital part of creating the necessary hardware for AI computing, especially for AI accelerators, such as NVIDIA's H100s. With the advent of the generative AI hype, GPU manufacturers rushed towards "pushing out" AI-focused products at their maximum capacity, which ultimately prompted the demand for CoWoS packaging as […]
Read more
News

AMD Reportedly Looks For Alternate CoWoS Suppliers As TSMC Reaches Full Capacity

Wccftech.com - 0
AMD is reportedly searching for alternate CoWoS suppliers, as Taiwanese giant TSMC reaches full production capacity amid high industry demand. AMD Now Focused On Looking For Alternatives For Its Instinct MI300 AI Accelerators, As TSMC Gets Busy With CoWoS Supply For NVIDIA It is reported by the Taiwanese outlet, CTEE, that AMD has decided to find alternatives to TSMC when it comes to acquiring CoWoS supply since the firm has been busy catering industry orders, particularly those from NVIDIA. The Taiwan giant is currently unable to cope with the demand, especially for CoWoS packaging, since the company's facilities haven't reached […]
Read more
News

Samsung’s Answer To TSMC’s CoWoS Is “SAINT” – Samsung Advanced Interconnection Technology For Next-Gen Chips

Wccftech.com - 0
Samsung is readying its own chip packaging solution to rival TSMC's CoWoS which is reportedly going to be called SAINT. Samsung SAINT & TSMC CoWoS Technologies Are Going To Compete To Secure Orders For Advanced Chip Packaging From Major Chipmakers Including NVIDIA & AMD The latest report comes from The Korean Economic Daily which is reporting that the Korean tech giant, Samsung, is readying its own advanced packaging solution to compete against the widely popular CoWoS (Chip-on-Wafer-on-Substrate) packaging technology from TSMC. It is reported that Samsung plans to unveil its solution next year and will be calling it SAINT or […]
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Tag: TSMC CoWoS

Here Is What Intel’s Flagship Core Ultra 9 285K “Arrow Lake” CPU Box Will Look Like

News
Intel's Arrow Lake "Core Ultra 200" CPU will feature a brand new box design and we have our first look at the packaging for the flagship Core Ultra 9 285K chip. Core Ultra 9 285K box shows Intel's next-gen design for the Arrow Lake CPUs Intel's Arrow Lake desktop CPUs are roughly one month away from coming to the shelves but we have already got plenty of leaks about the series, including specifications and some performance numbers. What we didn't have is the box concept for these CPUs, which now has been revealed by a user on Reddit. Remember that […]

Here Is What Intel’s Flagship Core Ultra 9 285K “Arrow Lake” CPU Box Will Look Like

News
Intel's Arrow Lake "Core Ultra 200" CPU will feature a brand new box design and we have our first look at the packaging for the flagship Core Ultra 9 285K chip. Core Ultra 9 285K box shows Intel's next-gen design for the Arrow Lake CPUs Intel's Arrow Lake desktop CPUs are roughly one month away from coming to the shelves but we have already got plenty of leaks about the series, including specifications and some performance numbers. What we didn't have is the box concept for these CPUs, which now has been revealed by a user on Reddit. Remember that […]

TSMC Wants To Scale Up Chips Using Bigger Packages As Part of Its System-on-Wafer “SoW” Technology

News
Well, forget chip shrinking and focus on interposer advancements. TSMC has implemented this by unveiling enormous plans for the next generation of SoW packaging. TSMC Sees Next-Gen "SoW" Chip Packaging As a Crucial Factor To Progress Into the Future, Making Chips Bigger Than Ever! Before diving into what TSMC has disclosed, let's talk about interposers. Imagine a chip in your hand. Well, it's a powerful one if you assume it. Now, if you are eager to harness more capabilities out of a single chip, instead of going the innovation route, the industry slaps multiple chips and connects them against each […]

TSMC To Invest $16 Billion Into Six New CoWoS Facilities In Taiwan As It Anticipates Huge AI Demand

News
TSMC is set to significantly upscale its CoWoS packaging output, as the Taiwan giant plans to spend almost US $16 billion on building new facilities. TSMC Looks To Rapidly Expand Its CoWoS Output Through Massive Investments, Ensuring a Seamless Supply Chain For AI Customers CoWoS packaging has seen a tremendous rise in demand in the past year, as resources play a vital role in manufacturing AI accelerators, which are the "holy grail" of the AI industry. As we transition into the next-gen era, AI GPU suppliers wouldn't certainly want to experience a supply chain bottleneck, which was previously caused by […]

TSMC to Double CoWoS Production By This Year, Attracting Huge Client Interest

News
TSMC is reportedly giving its all regarding the highly demanding CoWoS supply, as the Taiwanese giant plans to double down on production this year. TSMC Doubling CoWoS Production As AI Bandwagon Is Expected To Ride Its Way Into 2024, Expanding The Supply & Demand Chain To New Levels CoWoS packaging is considered a vital part of creating the necessary hardware for AI computing, especially for AI accelerators, such as NVIDIA's H100s. With the advent of the generative AI hype, GPU manufacturers rushed towards "pushing out" AI-focused products at their maximum capacity, which ultimately prompted the demand for CoWoS packaging as […]

AMD Reportedly Looks For Alternate CoWoS Suppliers As TSMC Reaches Full Capacity

News
AMD is reportedly searching for alternate CoWoS suppliers, as Taiwanese giant TSMC reaches full production capacity amid high industry demand. AMD Now Focused On Looking For Alternatives For Its Instinct MI300 AI Accelerators, As TSMC Gets Busy With CoWoS Supply For NVIDIA It is reported by the Taiwanese outlet, CTEE, that AMD has decided to find alternatives to TSMC when it comes to acquiring CoWoS supply since the firm has been busy catering industry orders, particularly those from NVIDIA. The Taiwan giant is currently unable to cope with the demand, especially for CoWoS packaging, since the company's facilities haven't reached […]

Samsung’s Answer To TSMC’s CoWoS Is “SAINT” – Samsung Advanced Interconnection Technology For Next-Gen Chips

News
Samsung is readying its own chip packaging solution to rival TSMC's CoWoS which is reportedly going to be called SAINT. Samsung SAINT & TSMC CoWoS Technologies Are Going To Compete To Secure Orders For Advanced Chip Packaging From Major Chipmakers Including NVIDIA & AMD The latest report comes from The Korean Economic Daily which is reporting that the Korean tech giant, Samsung, is readying its own advanced packaging solution to compete against the widely popular CoWoS (Chip-on-Wafer-on-Substrate) packaging technology from TSMC. It is reported that Samsung plans to unveil its solution next year and will be calling it SAINT or […]

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