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Apple Might Launch Its Own Smart Home Camera As It Focuses On Providing A More Integrated Product Experience For Its Users

Apple is increasingly focusing on building its own devices and expanding its ecosystem by taking steps towards a more native experience for users and relying less on third-party accessories. While the Cupertino-based tech giant's HomePod and AppleTV have left quite the mark in the smart home category, it generally relies more on outsourcing cameras and other hardware for smart homes. Now, a new report suggests that the company intends to create a fully integrated experience by developing its own smart home accessories. Gurman hints about Apple working on making smart home products like security cameras for a more integrated experience […]

Best of Black Friday 2024 – power stations and bundles: Anker SOLIX, Bluetti, EcoFlow, Jackery

We’re continuing our Best of Black Friday posts today with a look at the best current deals on power stations and their respective bundle options. Folks across the country and beyond have been steadily investing more and more in the industry for a vari...

World Of Warcraft Is Finally Getting Player Homes After 20 Years

Blizzard has announced that two decades after its release, World of Warcraft is finally going to let players build a home and live in it. The feature has long been requested by WoW players and now it’s finally coming in the game’s next expansion.Read m...

ArenaNet To Release ‘Godspawn’ Update for Guild Wars 2: Janthir Wilds on November 19, Featuring New 50-Player Titan Battle and More

Guild Wars 2: Janthir Wilds will receive the Godspawn update, adding a new 50-player boss battle, a new 10-player raid, and a legendary spear. Guild Wars 2: Janthir Wilds is getting the first major update "Godspawn" on November 19th, expanding the story with new story chapters The MMORPG Guild Wars 2 by ArenaNet is receiving its first major update for the Janthir Wilds expansion soon. It's the first of three major updates, and it'll land on November 19. The update will add new content to the game for the players. The Janthir Wilds expansion DLC was released in August this year, […]

TSMC Wants To Scale Up Chips Using Bigger Packages As Part of Its System-on-Wafer “SoW” Technology

Well, forget chip shrinking and focus on interposer advancements. TSMC has implemented this by unveiling enormous plans for the next generation of SoW packaging. TSMC Sees Next-Gen "SoW" Chip Packaging As a Crucial Factor To Progress Into the Future, Making Chips Bigger Than Ever! Before diving into what TSMC has disclosed, let's talk about interposers. Imagine a chip in your hand. Well, it's a powerful one if you assume it. Now, if you are eager to harness more capabilities out of a single chip, instead of going the innovation route, the industry slaps multiple chips and connects them against each […]

TSMC To Invest $16 Billion Into Six New CoWoS Facilities In Taiwan As It Anticipates Huge AI Demand

TSMC is set to significantly upscale its CoWoS packaging output, as the Taiwan giant plans to spend almost US $16 billion on building new facilities. TSMC Looks To Rapidly Expand Its CoWoS Output Through Massive Investments, Ensuring a Seamless Supply Chain For AI Customers CoWoS packaging has seen a tremendous rise in demand in the past year, as resources play a vital role in manufacturing AI accelerators, which are the "holy grail" of the AI industry. As we transition into the next-gen era, AI GPU suppliers wouldn't certainly want to experience a supply chain bottleneck, which was previously caused by […]

TSMC to Double CoWoS Production By This Year, Attracting Huge Client Interest

TSMC is reportedly giving its all regarding the highly demanding CoWoS supply, as the Taiwanese giant plans to double down on production this year. TSMC Doubling CoWoS Production As AI Bandwagon Is Expected To Ride Its Way Into 2024, Expanding The Supply & Demand Chain To New Levels CoWoS packaging is considered a vital part of creating the necessary hardware for AI computing, especially for AI accelerators, such as NVIDIA's H100s. With the advent of the generative AI hype, GPU manufacturers rushed towards "pushing out" AI-focused products at their maximum capacity, which ultimately prompted the demand for CoWoS packaging as […]

AMD Reportedly Looks For Alternate CoWoS Suppliers As TSMC Reaches Full Capacity

AMD is reportedly searching for alternate CoWoS suppliers, as Taiwanese giant TSMC reaches full production capacity amid high industry demand. AMD Now Focused On Looking For Alternatives For Its Instinct MI300 AI Accelerators, As TSMC Gets Busy With CoWoS Supply For NVIDIA It is reported by the Taiwanese outlet, CTEE, that AMD has decided to find alternatives to TSMC when it comes to acquiring CoWoS supply since the firm has been busy catering industry orders, particularly those from NVIDIA. The Taiwan giant is currently unable to cope with the demand, especially for CoWoS packaging, since the company's facilities haven't reached […]

Samsung’s Answer To TSMC’s CoWoS Is “SAINT” – Samsung Advanced Interconnection Technology For Next-Gen Chips

Samsung is readying its own chip packaging solution to rival TSMC's CoWoS which is reportedly going to be called SAINT. Samsung SAINT & TSMC CoWoS Technologies Are Going To Compete To Secure Orders For Advanced Chip Packaging From Major Chipmakers Including NVIDIA & AMD The latest report comes from The Korean Economic Daily which is reporting that the Korean tech giant, Samsung, is readying its own advanced packaging solution to compete against the widely popular CoWoS (Chip-on-Wafer-on-Substrate) packaging technology from TSMC. It is reported that Samsung plans to unveil its solution next year and will be calling it SAINT or […]

Tag: TSMC CoWoS

Vampire Survivors draws tons of inspiration from Castlevania, so it is no surprise that the new Ode To Castlevania DLC is fantastic. I’m here to guide you through unlocking each Hero and evolving each weapon, because that’s how you’ll end up accessing ...
I started playing Overwatch in 2019. By the time I was pushing payloads and getting Play of the Game with a well-placed Tactical Visor, a lot of the old hero kits and team compositions that were infamous when the hero shooter launched in 2016 were more...

TSMC Wants To Scale Up Chips Using Bigger Packages As Part of Its System-on-Wafer “SoW” Technology

Well, forget chip shrinking and focus on interposer advancements. TSMC has implemented this by unveiling enormous plans for the next generation of SoW packaging. TSMC Sees Next-Gen "SoW" Chip Packaging As a Crucial Factor To Progress Into the Future, Making Chips Bigger Than Ever! Before diving into what TSMC has disclosed, let's talk about interposers. Imagine a chip in your hand. Well, it's a powerful one if you assume it. Now, if you are eager to harness more capabilities out of a single chip, instead of going the innovation route, the industry slaps multiple chips and connects them against each […]

TSMC To Invest $16 Billion Into Six New CoWoS Facilities In Taiwan As It Anticipates Huge AI Demand

TSMC is set to significantly upscale its CoWoS packaging output, as the Taiwan giant plans to spend almost US $16 billion on building new facilities. TSMC Looks To Rapidly Expand Its CoWoS Output Through Massive Investments, Ensuring a Seamless Supply Chain For AI Customers CoWoS packaging has seen a tremendous rise in demand in the past year, as resources play a vital role in manufacturing AI accelerators, which are the "holy grail" of the AI industry. As we transition into the next-gen era, AI GPU suppliers wouldn't certainly want to experience a supply chain bottleneck, which was previously caused by […]

TSMC to Double CoWoS Production By This Year, Attracting Huge Client Interest

TSMC is reportedly giving its all regarding the highly demanding CoWoS supply, as the Taiwanese giant plans to double down on production this year. TSMC Doubling CoWoS Production As AI Bandwagon Is Expected To Ride Its Way Into 2024, Expanding The Supply & Demand Chain To New Levels CoWoS packaging is considered a vital part of creating the necessary hardware for AI computing, especially for AI accelerators, such as NVIDIA's H100s. With the advent of the generative AI hype, GPU manufacturers rushed towards "pushing out" AI-focused products at their maximum capacity, which ultimately prompted the demand for CoWoS packaging as […]

AMD Reportedly Looks For Alternate CoWoS Suppliers As TSMC Reaches Full Capacity

AMD is reportedly searching for alternate CoWoS suppliers, as Taiwanese giant TSMC reaches full production capacity amid high industry demand. AMD Now Focused On Looking For Alternatives For Its Instinct MI300 AI Accelerators, As TSMC Gets Busy With CoWoS Supply For NVIDIA It is reported by the Taiwanese outlet, CTEE, that AMD has decided to find alternatives to TSMC when it comes to acquiring CoWoS supply since the firm has been busy catering industry orders, particularly those from NVIDIA. The Taiwan giant is currently unable to cope with the demand, especially for CoWoS packaging, since the company's facilities haven't reached […]

Samsung’s Answer To TSMC’s CoWoS Is “SAINT” – Samsung Advanced Interconnection Technology For Next-Gen Chips

Samsung is readying its own chip packaging solution to rival TSMC's CoWoS which is reportedly going to be called SAINT. Samsung SAINT & TSMC CoWoS Technologies Are Going To Compete To Secure Orders For Advanced Chip Packaging From Major Chipmakers Including NVIDIA & AMD The latest report comes from The Korean Economic Daily which is reporting that the Korean tech giant, Samsung, is readying its own advanced packaging solution to compete against the widely popular CoWoS (Chip-on-Wafer-on-Substrate) packaging technology from TSMC. It is reported that Samsung plans to unveil its solution next year and will be calling it SAINT or […]

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