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Elden Ring Gets Free AMD FSR 3 Frame Generation Mod

Wccftech.com - 0
It's been a year and a half since PureDark released his Elden Ring NVIDIA DLSS 3 Frame Generation mod. The paid mod allowed GeForce RTX 40 Series owners a significant performance boost in the notoriously badly optimized game developed by FromSoftware. However, everyone else without an RTX 40 Series GPU has been out of luck so far. That changes with the recently released free AMD FSR Frame Generation and Temporal Super Resolution (ERSS-FG) mod by Nexus Mods user huutaiii. This mod supports AMD FSR 3 Super Resolution and Frame Generation, NVIDIA DLSS Super Resolution and DLAA, and even Intel XeSS. […]
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Dimensity 8400 CPU Cluster Details Shared By A Tipster; New Specifications Information Reveal An All-Performance Core Configuration, But Excludes The Cortex-X925

Wccftech.com - 0
The Dimensity 9400 is not going to be MediaTek’s only chipset featuring a CPU cluster comprising of just performance cores because the company is said to be in the middle of launching its non-flagship SoC, the Dimensity 8400. A tipster has now shared the potential configuration of the upcoming silicon, with one of the major differences being is that it will lack Cortex-X925 cores. New rumor claims that the Dimensity 8400’s CPU cluster will only include Cortex-A725 cores, with TSMC’s 4nm process helping to improve efficiency A traditional 8-core cluster is said to be used for the Dimensity 8400, according […]
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Anker Gear Up for Black Friday sale now live: Buy 2 extra 20% off, Buy 3 extra 25% off, mystery gifts, more

9to5Toys.com - 0
Anker has now transitioned from its early Black Friday sale over to what it is referring to as its Gear Up for Black Friday event. Alongside markdowns on everything from its latest Prime charging stations to travel chargers, MagSafe stands, cables, and...
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Call of Duty: Black Ops 6 Witnesses 52% Of Total US Xbox Players Checking It Out, a New Record

Wccftech.com - 0
Call of Duty: Black Ops 6 has witnessed a fantastic launch, probably the franchise's most successful entry, as it captured the attention of over half of the US Xbox Series S/X players. Well, it won't be wrong to say that Call of Duty: Black Ops 6 has managed to put behind all the woes we had with Activision and partners in terms of their take on the franchise since the newest entry has managed to break all previous records, in terms of the anticipation and hype. During Microsoft's recent earnings call, CEO Satya Nadella verified that Call of Duty: Black […]

Target’s Day 5 Black Friday Deals now live: 50% off headphones, sparkling water, BOGO 50% groceries, more from $1

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TSMC Wants To Scale Up Chips Using Bigger Packages As Part of Its System-on-Wafer “SoW” Technology

Wccftech.com - 0
Well, forget chip shrinking and focus on interposer advancements. TSMC has implemented this by unveiling enormous plans for the next generation of SoW packaging. TSMC Sees Next-Gen "SoW" Chip Packaging As a Crucial Factor To Progress Into the Future, Making Chips Bigger Than Ever! Before diving into what TSMC has disclosed, let's talk about interposers. Imagine a chip in your hand. Well, it's a powerful one if you assume it. Now, if you are eager to harness more capabilities out of a single chip, instead of going the innovation route, the industry slaps multiple chips and connects them against each […]
Read more
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TSMC To Invest $16 Billion Into Six New CoWoS Facilities In Taiwan As It Anticipates Huge AI Demand

Wccftech.com - 0
TSMC is set to significantly upscale its CoWoS packaging output, as the Taiwan giant plans to spend almost US $16 billion on building new facilities. TSMC Looks To Rapidly Expand Its CoWoS Output Through Massive Investments, Ensuring a Seamless Supply Chain For AI Customers CoWoS packaging has seen a tremendous rise in demand in the past year, as resources play a vital role in manufacturing AI accelerators, which are the "holy grail" of the AI industry. As we transition into the next-gen era, AI GPU suppliers wouldn't certainly want to experience a supply chain bottleneck, which was previously caused by […]
Read more
News

TSMC to Double CoWoS Production By This Year, Attracting Huge Client Interest

Wccftech.com - 0
TSMC is reportedly giving its all regarding the highly demanding CoWoS supply, as the Taiwanese giant plans to double down on production this year. TSMC Doubling CoWoS Production As AI Bandwagon Is Expected To Ride Its Way Into 2024, Expanding The Supply & Demand Chain To New Levels CoWoS packaging is considered a vital part of creating the necessary hardware for AI computing, especially for AI accelerators, such as NVIDIA's H100s. With the advent of the generative AI hype, GPU manufacturers rushed towards "pushing out" AI-focused products at their maximum capacity, which ultimately prompted the demand for CoWoS packaging as […]
Read more
News

AMD Reportedly Looks For Alternate CoWoS Suppliers As TSMC Reaches Full Capacity

Wccftech.com - 0
AMD is reportedly searching for alternate CoWoS suppliers, as Taiwanese giant TSMC reaches full production capacity amid high industry demand. AMD Now Focused On Looking For Alternatives For Its Instinct MI300 AI Accelerators, As TSMC Gets Busy With CoWoS Supply For NVIDIA It is reported by the Taiwanese outlet, CTEE, that AMD has decided to find alternatives to TSMC when it comes to acquiring CoWoS supply since the firm has been busy catering industry orders, particularly those from NVIDIA. The Taiwan giant is currently unable to cope with the demand, especially for CoWoS packaging, since the company's facilities haven't reached […]
Read more
News

Samsung’s Answer To TSMC’s CoWoS Is “SAINT” – Samsung Advanced Interconnection Technology For Next-Gen Chips

Wccftech.com - 0
Samsung is readying its own chip packaging solution to rival TSMC's CoWoS which is reportedly going to be called SAINT. Samsung SAINT & TSMC CoWoS Technologies Are Going To Compete To Secure Orders For Advanced Chip Packaging From Major Chipmakers Including NVIDIA & AMD The latest report comes from The Korean Economic Daily which is reporting that the Korean tech giant, Samsung, is readying its own advanced packaging solution to compete against the widely popular CoWoS (Chip-on-Wafer-on-Substrate) packaging technology from TSMC. It is reported that Samsung plans to unveil its solution next year and will be calling it SAINT or […]
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Tag: TSMC CoWoS

First Amazon price drops on the new M4 Mac mini now live, but you might be better off at Best Buy

Deals
We aren’t talking about massive price drops here, and nothing quite as good as the elevated trade-in values we featured at Best Buy, but Amazon has shaved the MSRP on Apple’s new M4 Mac mini ahead of release this week. If you have gear to trade-in for ...

Today only: Save a big-time $350 on the Samsung 14-inch Galaxy Tab S9 Ultra at $850

Deals
While the new Tab S10 is now out in the wild, today’s Best Buy Deals of the Day are landing with a big-time $350 price drop on the still more than capable Samsung Galaxy Tab S9 Ultra. Regularly $1,200 and currently marked down to $899.99 directly from ...

TSMC Wants To Scale Up Chips Using Bigger Packages As Part of Its System-on-Wafer “SoW” Technology

News
Well, forget chip shrinking and focus on interposer advancements. TSMC has implemented this by unveiling enormous plans for the next generation of SoW packaging. TSMC Sees Next-Gen "SoW" Chip Packaging As a Crucial Factor To Progress Into the Future, Making Chips Bigger Than Ever! Before diving into what TSMC has disclosed, let's talk about interposers. Imagine a chip in your hand. Well, it's a powerful one if you assume it. Now, if you are eager to harness more capabilities out of a single chip, instead of going the innovation route, the industry slaps multiple chips and connects them against each […]

TSMC To Invest $16 Billion Into Six New CoWoS Facilities In Taiwan As It Anticipates Huge AI Demand

News
TSMC is set to significantly upscale its CoWoS packaging output, as the Taiwan giant plans to spend almost US $16 billion on building new facilities. TSMC Looks To Rapidly Expand Its CoWoS Output Through Massive Investments, Ensuring a Seamless Supply Chain For AI Customers CoWoS packaging has seen a tremendous rise in demand in the past year, as resources play a vital role in manufacturing AI accelerators, which are the "holy grail" of the AI industry. As we transition into the next-gen era, AI GPU suppliers wouldn't certainly want to experience a supply chain bottleneck, which was previously caused by […]

TSMC to Double CoWoS Production By This Year, Attracting Huge Client Interest

News
TSMC is reportedly giving its all regarding the highly demanding CoWoS supply, as the Taiwanese giant plans to double down on production this year. TSMC Doubling CoWoS Production As AI Bandwagon Is Expected To Ride Its Way Into 2024, Expanding The Supply & Demand Chain To New Levels CoWoS packaging is considered a vital part of creating the necessary hardware for AI computing, especially for AI accelerators, such as NVIDIA's H100s. With the advent of the generative AI hype, GPU manufacturers rushed towards "pushing out" AI-focused products at their maximum capacity, which ultimately prompted the demand for CoWoS packaging as […]

AMD Reportedly Looks For Alternate CoWoS Suppliers As TSMC Reaches Full Capacity

News
AMD is reportedly searching for alternate CoWoS suppliers, as Taiwanese giant TSMC reaches full production capacity amid high industry demand. AMD Now Focused On Looking For Alternatives For Its Instinct MI300 AI Accelerators, As TSMC Gets Busy With CoWoS Supply For NVIDIA It is reported by the Taiwanese outlet, CTEE, that AMD has decided to find alternatives to TSMC when it comes to acquiring CoWoS supply since the firm has been busy catering industry orders, particularly those from NVIDIA. The Taiwan giant is currently unable to cope with the demand, especially for CoWoS packaging, since the company's facilities haven't reached […]

Samsung’s Answer To TSMC’s CoWoS Is “SAINT” – Samsung Advanced Interconnection Technology For Next-Gen Chips

News
Samsung is readying its own chip packaging solution to rival TSMC's CoWoS which is reportedly going to be called SAINT. Samsung SAINT & TSMC CoWoS Technologies Are Going To Compete To Secure Orders For Advanced Chip Packaging From Major Chipmakers Including NVIDIA & AMD The latest report comes from The Korean Economic Daily which is reporting that the Korean tech giant, Samsung, is readying its own advanced packaging solution to compete against the widely popular CoWoS (Chip-on-Wafer-on-Substrate) packaging technology from TSMC. It is reported that Samsung plans to unveil its solution next year and will be calling it SAINT or […]

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