MediaTek previously announced that it has successfully developed the 3nm SoC with TSMC, making it 32 percent more power-efficient than previous-generation silicon, though the exact name of the chipset was not mentioned. Now, the Taiwanese company’s CEO has spoken about the close partnership with its foundry partner, stating that both entities are working together to launch its first 3nm product, which is rumored to be called the Dimensity 9400. TSMC, and MediaTek could be working together to optimize efficiency for the Dimensity 9400, as just like the Dimensity 9300, it will reportedly lack low-power cores Comparing 2024 with 2023, MediaTek […]
Read full article at https://wccftech.com/mediatek-ceo-says-tsmc-work-done-closely-for-3nm-chipset/
WccftechContinue reading/original-link]