New technologies were used to mass produce the Exynos 2400, with one of them being Samsung’s 4LPP+ process, which has not only improved yields but also increased power efficiency. However, one important tidbit that the company left out but did manage to present on its website was the use of Fan-out Wafer Level Packaging or FOWLP, and the Exynos 2400 is the first smartphone SoC from the Korean giant to flaunt this type of packaging. Here are all the advantages that come with it. FOWLP also utilizes lower heat resistance while reducing the Exynos 2400 package size to improve heat […]
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