Samsung may not have much success with its 3nm GAA process, but it intends to make amends with its next-generation 2nm technology, which is said to enter mass production next year. To gain an edge against its foundry rival TSMC, a new report states that the Korean giant is introducing Backside Power Supply (BSPDN) technology, which aims to offer several benefits, which we will discuss here. BSPDN technology was supposedly tested with two ARM cores, and Samsung managed to reduce the chip area of both by a varying degree It is going to be a competitive matchup between Samsung and TSMC as […]
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