The Tensor G4 will likely be powering the Pixel 9 and Pixel 9 Pro later this year, and while Google’s chipsets have historically delivered poorer performance and efficiency metrics compared to the competition, the upcoming chipset is rumored to receive a few upgrades. Going in the path of the Exynos 2400, a new report says that the Tensor G4 will be treated to FOWLP or ‘Fan out Wafer Level Packaging.’ While we have discussed the advantages of using this technology, let us inform readers who are hearing about it for the first time as its benefits might compel them to upgrade […]
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