Huawei has remained mum on the subject of building its own fabrication plants, and that is likely to avoid further trade restrictions from the U.S. However, a recent patent filing provides evidence that the former Chinese giant is going the extra mile to reduce dependency on foreign companies. The patent application date is June 2022, describing a process for improving wafer alignment and efficiency. It is titled ‘Wafer Processing Device and Wafer Processing Method’ and provides some evidence that Huawei wishes to build its chip plants, which can mean it may want to rid itself of SMIC too. Huawei has […]
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